other
PCB Capacity

General Capabilities


  • Single Sided
  • Double Sided
  • Multi Layer
  • Burried Via
  • Blind Via
  • Impedance Controlled
  • Micro Via
  • Laser Drilling
  • RoHS Compliance
  • Epoxy filled vias


Rigid PCB


Item
Spec
Layers
1~20
Board Thickness
0.1mm-8.0mm
Material
FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, etc
Max Panel Size
600mm×1200mm
Min Hole Size
0.1mm
Min Line Width/Space
3mil(0.075mm)
Board Outline Tolerance
士0.10mm
Insulation Layer Thickness
0.075mm--5.00mm
Out Layer Copper Thickness
18um--350um
Drilling Hole (Mechanical)
17um--175um
Finish Hole (Mechanical)
17um--175um
Diameter Tolerance (Mechanical)
0.05mm
Registration (Mechanical)
0.075mm
Aspect Ratio
16:01
Solder Mask Type
LPI
SMT Min. Solder Mask Width
0.075mm
Min. Solder Mask Clearance
0.05mm
Plug Hole Diameter
0.25mm--0.60mm
Impedance Control Tolerance
士10%
Surface finish
ENIG, OSP, HASL, Chem. Tin/Sn, Flash Gold, etc
Soldermask
Green/Yellow/Black/White/Red/Blue
Silkscreen
Red/Yellow/Black/White
Certificate
UL, ISO 9001, ISO14001, IATF16949 
Special Request
Blind hole, Gold finger, BGA, Carbon ink, peekable mask, VIP process, Edge plating, Half holesetc
Material Suppilers
Shengyi, ITEQ, Taiyo, etc.
Common Package
Vacuum+Carton


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