General Capabilities
-
Single Sided
-
Double Sided
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Multi Layer
-
Burried Via
-
Blind Via
-
Impedance Controlled
-
Micro Via
-
Laser Drilling
-
RoHS Compliance
-
Epoxy filled vias
Rigid PCB
Item
|
Spec
|
Layers
|
1~20
|
Board Thickness
|
0.1mm-8.0mm
|
Material
|
FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, etc
|
Max Panel Size
|
600mm×1200mm
|
Min Hole Size
|
0.1mm
|
Min Line Width/Space
|
3mil(0.075mm)
|
Board Outline Tolerance
|
士0.10mm
|
Insulation Layer Thickness
|
0.075mm--5.00mm
|
Out Layer Copper Thickness
|
18um--350um
|
Drilling Hole (Mechanical)
|
17um--175um
|
Finish Hole (Mechanical)
|
17um--175um
|
Diameter Tolerance (Mechanical)
|
0.05mm
|
Registration (Mechanical)
|
0.075mm
|
Aspect Ratio
|
16:01
|
Solder Mask Type
|
LPI
|
SMT Min. Solder Mask Width
|
0.075mm
|
Min. Solder Mask Clearance
|
0.05mm
|
Plug Hole Diameter
|
0.25mm--0.60mm
|
Impedance Control Tolerance
|
士10%
|
Surface finish
|
ENIG, OSP, HASL, Chem. Tin/Sn, Flash Gold, etc
|
Soldermask
|
Green/Yellow/Black/White/Red/Blue
|
Silkscreen
|
Red/Yellow/Black/White
|
Certificate
|
UL, ISO 9001, ISO14001, IATF16949
|
Special Request
|
Blind hole, Gold finger, BGA, Carbon ink, peekable mask, VIP process, Edge plating, Half holes, etc
|
Material Suppilers
|
Shengyi, ITEQ, Taiyo, etc.
|
Common Package
|
Vacuum+Carton
|
Englishen
