ABIS focuses on full Turnkey and Complete PCB Assembly services, we are also capable of managing orders with partial or fully Consigned Parts procurement. We follow a highly systematic and well-organized PCB parts purchasing schedule, which has been designed to fit smoothly into our PCB Assembly Process to ensure maximum efficiency for your project. Meanwhile, ABIS sourcing the components directly with components original manufacturer and official agent. Such as Digikey, Mouser, Future, Avnet and so on.
ABIS provides powerful one-stop supply chain execution with “what-if” scenario planning in real time. We help you adapt to the market faster and more efficiently—creating new opportunities for your organization.
Components storage
(1) After the components arrive in the warehouse, the warehouse manager will take inventory and place them to be inspected. Bulk goods can be placed directly in the warehouse qualified area, but they should be marked as "for inspection". Then the QC will verify and apply for inspection on arrival.
Verification content includes:
(1) Product name, model specification, manufacturer, production date or batch number, shelf life, quantity, packaging status and qualification certificates, etc. If it is not qualified after verification, the purchaser shall be notified to negotiate or process the return.
(2) After receiving the inspection report that concludes as "qualified", the warehouse keeper shall go through the warehousing procedures in time,and the goods in the inspection area are transferred to the qualified area of the warehouse for storage. The products to be inspected that have been placed in the qualified area of the warehouse shall be removed from the "Pending Inspection" mark; when an inspection report with an inspection conclusion of "unqualified" is received, Make the non-conforming mark according to the regulations and wait for the non-conforming product.
PCB Assembly Capability |
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Single and double sided SMT/PTH |
Yes |
Large parts on both sides, BGA on both sides |
Yes |
Smallest Chips size |
0201 |
Min BGA and Micro BGA pitch and ball counts |
0.008 in. (0.2mm) pitch, ball count greater than 1000 |
Min Leaded parts pitch |
0.008 in. (0.2 mm) |
Max Parts size assembly by machine |
2.2 in. x 2.2 in. x 0.6 in. |
Assembly surface mount connectors |
Yes |
Odd form parts: |
Yes, Assembly by hands |
LED |
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Resistor and capacitor networks |
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Electrolytic capacitors |
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Variable resistors and capacitors (pots) |
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Sockets |
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Reflow soldering |
Yes |
Max PCB size |
14.5 in. x 19.5 in. |
Min PCB Thickness |
0.2 |
Fiducial Marks |
Preferred but not required |
PCB Finish: |
1.SMOBC/HASL |
2.Electrolytic gold |
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3.Electroless gold |
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4.Electroless silver |
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5.Immersion gold |
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6.Immersion tin |
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7.OSP |
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PCB Shape |
Any |
Panelized PCB |
1.Tab routed |
2.Breakaway tabs |
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3.V-Scored |
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4.Routed+ V scored |
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Inspection |
1.X-ray analysis |
2.Microscope to 20X |
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Rework |
1.BGA removal and replacement station |
2.SMT IR rework station |
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3.Thru-hole rework station |
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Firmware |
Provide programming firmware files, irmware + software installation instructions |
Function test |
Level of testing required along with test instructions |
PCB file: |
PCB Altium/Gerber/Eagle files (Including specs such as thickness, copper thickness, solder mask colour, finish, etc) |
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