Ibhodi yesekethe echanekileyo ephezulu ibhekisa kusetyenziso lobubanzi/isithuba somgca ocolekileyo, imingxuma emincinci, ububanzi obumxinwa bomsesane (okanye akukho bubanzi besangqa), kunye nemingxunya engcwatyiweyo neyimfama ukufikelela ukuxinana okuphezulu.Kwaye ukuchaneka okuphezulu kuthetha ukuba isiphumo "esincinci, esincinci, esincinci, esincinci," ngokuqinisekileyo siya kuzisa iimfuno ezichanekileyo eziphezulu, thatha ububanzi bomgca njengomzekelo: O. 20mm ububanzi bomgca, ngokwemimiselo yokuvelisa i-O. 16 ~ 0.24mm ifanelekile, impazamo yi (O.20 ± 0.04) mm;kunye no-O. Kububanzi bomgca we-10mm, impazamo yi (0.10±0.02) mm.Ngokucacileyo, ukuchaneka kokugqibela kuphindwe kabini, kwaye njalo akunzima ukuyiqonda, ngoko ke iimfuno ezichanekileyo aziyi kuxoxwa ngokwahlukileyo.Kodwa yingxaki ebalaseleyo kwitekhnoloji yemveliso. 
(1) Ubugcisa bocingo olucokisekileyo
Ububanzi bocingo oluphezulu oluphezulu oluphezulu/isithuba luya kutshintshwa ukusuka ku-0.20mm-O.I-13mm-0.08mm-0.005mm inokuhlangabezana neemfuno ze-SMT kunye ne-multi-chip package (i-Multichip Package, MCP).Ngoko ke, ezi ndlela zilandelayo ziyafuneka.
① Ukusebenzisa i-foil yobhedu ebhityileyo okanye ecwecwe kakhulu (<18um) i-substrate kunye neteknoloji yonyango oluphezulu. ② Ukusetyenziswa kwefilimu eyomileyo eyomileyo kunye nenkqubo yefilimu emanzi, ifilimu eyomileyo kunye neyomgangatho omhle inokunciphisa ukuphambuka kobubanzi kunye neziphene.I-lamination emanzi inokuzalisa izithuba ezincinci zomoya, ukwandisa ukunamathela kwi-interfacial adhesion, kunye nokuphucula ingqibelelo yocingo kunye nokuchaneka. ③ Ukusebenzisa ifilimu ye-electrodeposited photoresist (i-Electro-deposited Photoresist, ED).Ubukhulu bayo bunokulawulwa kuluhlu lwe-5-30 / um, olunokuvelisa iingcingo ezintle ezigqibeleleyo, ngakumbi ezifanelekileyo kububanzi obumxinwa, akukho bubanzi be-ring kunye ne-electroplating epheleleyo.Okwangoku, kukho imigca yemveliso ye-ED engaphezu kweshumi emhlabeni. ④Ukusebenzisa itekhnoloji yokuvezwa kokukhanya okuhambelanayo.Ekubeni ukubonakaliswa kokukhanya okuhambelanayo kunokoyisa impembelelo yokwahluka kobubanzi bomgca okubangelwa ukukhanya kwe-oblique ye-"point" yomthombo wokukhanya, iingcingo ezintle ezinomlinganiselo ochanekileyo wobubanzi bomgca kunye nemiphetho ecocekileyo inokufumaneka.Nangona kunjalo, izixhobo ze-parallel exposure ziyabiza, zifuna utyalo-mali oluphezulu, kwaye zifuna umsebenzi kwindawo ecocekileyo. ⑤ Yamkela itekhnoloji yokuhlola ngokuzenzekelayo (uHlolo oluzenzekelayo lwe-Optical, i-AOI).Le teknoloji iye yaba yindlela ebalulekileyo yokubona ukuveliswa kweengcingo ezintle, kwaye ikhuthazwa ngokukhawuleza, isetyenziswe kwaye iphuhliswe.Umzekelo, iNkampani ye-AT&T ine-11 AoIs, kwaye}iNkampani ye-tadco ine-21 AoIs esetyenziswa ngokukodwa ukubona imizobo yomaleko wangaphakathi. (2) Iteknoloji yeMicrovia
Imingxuma esebenzayo yeebhodi eziprintiweyo ezisetyenziselwa ukunyuswa komphezulu ikakhulu zidlala indima yokudibanisa umbane, okwenza ukusetyenziswa kweteknoloji ye-microvia kubaluleke ngakumbi.Ukusebenzisa i-drill bit materials eqhelekileyo kunye noomatshini bokomba be-CNC ukuvelisa imingxuma emincinci kunokusilela okuninzi kunye neendleko eziphezulu.Ngoko ke, ukuxinana kweebhodi eziprintiweyo ubukhulu becala kubangelwa ukuxinana kweengcingo kunye neepads.Nangona impumelelo enkulu yenziwe, amandla ayo alinganiselwe.Ukuphucula ngakumbi ukuxinana (okufana neengcingo ezingaphantsi kwe-0.08mm), iindleko zingxamisekile.iilitha, ngaloo ndlela ujikela ekusebenziseni i-micropores ukuphucula ukuxinana.
Kwiminyaka yakutshanje, ukuphumelela kuye kwenziwa kumatshini wokugaya i-CNC kunye neteknoloji ye-micro-drill, ngoko ke iteknoloji ye-micro-hole iphuhliswe ngokukhawuleza.Le yeyona nto ibalaseleyo kwimveliso yePCB yangoku.Kwixesha elizayo, itekhnoloji yokwenza imingxunya emincinci iya kuxhomekeka ikakhulu koomatshini bokugrumba be-CNC kunye neentloko ezincinci ezibalaseleyo, ngelixa imingxuma eyenziwe ngetekhnoloji ye-laser isengaphantsi kwaleyo yenziwe ngoomatshini bokomba be-CNC ukusuka kwindawo yokujonga iindleko kunye nomgangatho womngxuma. . ① Umatshini wokumba weCNC Okwangoku, itekhnoloji yomatshini wokugaya weCNC yenze inkqubela phambili kunye nenkqubela phambili.Kwaye kwaseka isizukulwana esitsha somatshini wokomba we-CNC ophawulwa ngokugrumba imingxunya emincinci.Ukusebenza kakuhle kokugaya imingxuma emincinci (ngaphantsi kwe-0.50mm) ngumatshini wokugaya i-micro-hole i-1 amaxesha aphezulu kunomatshini oqhelekileyo we-CNC wokugaya, kunye nokungaphumeleli okumbalwa, kunye nesantya sokujikeleza ngu-11-15r / min;iyakwazi ukugrumba i-O. 1 ~ 0.2mm imingxuma emincinci, i-drill encinci ekumgangatho ophezulu kunye nomxholo ophezulu we-cobalt isetyenzisiweyo, kwaye iipleyiti ezintathu (1.6mm / ibhloko) zinokupakishwa ukugrunjwa.Xa i-drill bit yaphukile, inokuyeka ngokuzenzekelayo kwaye ichaze isikhundla, ibuyisele ngokuzenzekelayo i-drill bit kwaye ukhangele ububanzi (imagazini yesixhobo ingakwazi ukuhlalisa amakhulu amaqhekeza), kwaye inokulawula ngokuzenzekelayo umgama oqhubekayo phakathi kwencam ye-drill kunye nesigqubuthelo. ipleyiti kunye nobunzulu bokomba, ngoko ke imingxuma eyimfama inokugrunjwa., kwaye ayiyi kulimaza i-countertop.Itheyibhile yomatshini wokubhola we-CNC wamkela umqamelo womoya kunye nohlobo oludadayo lwemagnethi, oluhamba ngokukhawuleza, lula kwaye luchane ngakumbi, kwaye aluyi kukrwela itafile.Olo hlobo lokushicilela lufumaneka ngokunqongopheleyo, njengeMega 4600 esuka ePrute e-Itali, i-ExcelIon 2000 series e-United States, kunye neemveliso zesizukulwana esitsha ezivela eSwitzerland naseJamani. ② Zininzi ngokwenene iingxaki zokomba oomatshini bokugrumba be-CNC besiqhelo kunye nokugrumba imingxuma emincinci.Ithintele inkqubela yetekhnoloji ye-micro hole, ngoko ke i-laser hole etching inikwe ingqalelo, uphando kunye nokusetyenziswa.Kodwa kukho ukungonakali okubulalayo, oko kukuthi, ukubunjwa kwemingxuma yezigodlo, eyongezelelekileyo ngokunyuka kweplate.Ukongeza kungcoliseko lokukhutshwa kobushushu obuphezulu (ingakumbi iibhodi ezinomaleko amaninzi), ubomi kunye nokugcinwa komthombo wokukhanya, ukuphinda-phinda komngxuma wokuqhafaza kunye neendleko, ukukhuthazwa kunye nokusetyenziswa kwemingxunya emincinci kwimveliso yeebhodi eziprintiweyo. ibe yimida.Nangona kunjalo, i-laser ablation isasetyenziswa kwi-microplates encinci kunye ne-high-density microplates, ngakumbi kwi-high-density interconnect (HDI) iteknoloji ye-MCM-L, njenge-M. c.Isetyenziswe ekudibaneni koxinaniso oluphezulu oludibanisa ifilimu yepolyester efakwe kwiNks kunye ne-metal deposition (i-sputtering technique).Ungcwatywa ngendlela yolwakhiwo kwiibhodi zoqhagamshelo olunoxinaniso oluphezulu olunokungcwatywa kunye nokungaboniyo ngokusebenzisa izakhiwo nazo zingasetyenziswa.Nangona kunjalo, ngenxa yophuhliso kunye nokuphumelela kwetekhnoloji yoomatshini bokomba be-CNC kunye namasuntswana okomba amancinci, baye bakhuthazwa kwaye basetyenziswa ngokukhawuleza.Ngaloo ndlela i-laser yemba imingxuma phezu komhlaba Izicelo kwiibhodi zeesekethe ezixhonyiweyo azikwazi ukwenza ubukhosi.Kodwa isenayo indawo kwindawo ethile. ③Ubuchwephesha bokungcwatywa, obumfama kunye nobomngxunya Umndibaniselwano wobugcisa obungcwatyiweyo, obumfama nobomngxunya bukwayindlela ebalulekileyo yokuphucula ukuxinana okuphezulu kweesekethe ezishicilelweyo.Ngokubanzi, ukungcwatywa kunye ne-vias eyimfama yimingxuma emincinci.Ukongeza ekunyuseni inani leentambo ebhodini, ii-vias ezingcwatyelwe kunye neemfama ziyadityaniswa phakathi kwe "ekufutshane" zomaleko zangaphakathi, ezinciphisa kakhulu inani lemingxunya eyenziweyo, kunye nokusetwa kwediski yokwahlula kuya kunciphisa kakhulu inani leentambo. nge.Ukunciphisa, ngokwandisa inani le-wiring esebenzayo kunye ne-interlayer interlayer ebhodini, kunye nokuphucula ukuxinana okuphezulu koqhagamshelwano.Ngoko ke, ibhodi ye-multi-layer kunye nokudibanisa ukungcwatywa, imfama kunye ne-hole-hole ubuncinane ngamaxesha angama-3 ngaphezu kwesakhiwo sebhodi esiqhelekileyo esiphantsi kobukhulu obufanayo kunye nenani leengqimba.Ubungakanani bebhodi eprintiweyo edibeneyo kunye nemingxuma iya kuncitshiswa kakhulu okanye inani leeleya liya kuncitshiswa kakhulu.Ke ngoko, kuxinaniso oluphezulu lweebhodi eziprintiweyo zomphezulu, ukungcwatywa kunye nokungaboniyo ngokusebenzisa itekhnoloji ziya zisetyenziswa ngakumbi, kungekuphela nje kwiibhodi eziprintiweyo eziphezulu kwiikhompyuter ezinkulu, izixhobo zonxibelelwano, njl.Ikwasetyenziswa ngokubanzi kwibala le, kwaye nakwezinye iibhodi ezibhityileyo, ezinje ngeebhodi ezibhityileyo ezinamaleko angaphezu kwamathandathu ePCMCIA ezahlukeneyo, Smart, amakhadi e-IC, njl. I iibhodi zesekethe eziprintiweyo ezinomngxuma ongcwatyiweyo noyimfama izakhiwo zigqitywe ngokubanzi nge "ibhodi yokwahlula" indlela yokuvelisa, nto leyo ethetha ukuba inokugqityezelwa emva kwamaxesha amaninzi okucinezela, ukugrumba, ukucholwa komngxuma, njl. njl., ngoko ke ukubeka ngokuchanekileyo kubaluleke kakhulu.. 
English en 
