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Me yasa allunan da'ira na PCB suke buƙatar ayan/toshe/cika vias?

  • 2022-06-29 10:41:07
Via rami kuma ana kiranta via rami.Domin biyan bukatun abokin ciniki, da allon kewayawa ta rami dole ne a toshe.Bayan an yi aiki da yawa, an canza tsarin ramin filogi na al'ada, kuma ana kammala abin rufe fuska da filogi na saman allo da farar raga.rami.Stable samarwa da ingantaccen inganci.

Ta ramuka suna taka rawar haɗin kai da gudanar da layi.Haɓaka masana'antar lantarki kuma yana haɓaka haɓakar PCBs, kuma yana gabatar da buƙatu mafi girma don fasahar masana'anta da aka buga da fasahar hawan dutse.Fasahar toshe rami ta samo asali, kuma ya kamata a cika waɗannan buƙatu a lokaci guda:


(1) Akwai jan ƙarfe ne kawai a cikin rami, kuma ana iya toshe abin rufe fuska ko a'a;

(2) Dole ne a sami tin da gubar a cikin ramin, tare da ƙayyadaddun buƙatu mai kauri (4 microns), kuma kada wani tawada mai tsayayya da tawada ya shiga cikin ramin, yana haifar da ɓoye kwano a cikin ramin;

(3) Dole ne mai ramukan ya kasance yana da ramukan filogi na tawada mai siyar, bayyanuwa, kuma dole ne ya kasance ba ya da da'irar kwano, beads na kwano, da buƙatun daidaitawa.


Me yasa allunan da'ira na PCB ke buƙatar toshe vias?

Tare da haɓaka samfuran lantarki a cikin hanyar "haske, bakin ciki, gajere da ƙanana", PCBs kuma suna haɓaka zuwa babban yawa da wahala.Saboda haka, babban adadin SMT da BGA PCBs sun bayyana, kuma abokan ciniki suna buƙatar ramukan toshe lokacin hawa abubuwan haɗin gwiwa, galibi gami da ayyuka biyar:


(1) Hana tin daga kutsawa ta cikin sassan sassan ta ramin don haifar da gajeren da'ira lokacin da PCB ya wuce ta hanyar sayar da igiyar ruwa;musamman lokacin da muka sanya ramin a kan kushin BGA, dole ne mu fara yin rami mai toshewa, sa'an nan kuma an yi zinari don sauƙaƙe siyarwar BGA.


(2) Guji ragowar ruwa a cikin rami;

(3) Bayan da saman dutsen da kuma bangaren taro na Electronics factory da aka kammala, da PCB dole ne a vacuumed a kan gwaji na'ura don samar da wani mummunan matsa lamba kafin a kammala shi:

(4) Hana manna solder ɗin da ke gudana a cikin rami don haifar da walda mai kama-da-wane, wanda ke shafar hawan;

(5) Hana ƙullun kwano daga fitowa a lokacin sayar da igiyar ruwa, haifar da gajeren kewayawa.



Ganewar Fasahar Haɓaka Hole Plugging
Don allunan ɗorawa, musamman don hawan BGA da IC, ta hanyar ramukan dole ne su zama lebur, tare da convex da concave da ko ragi mil 1, kuma dole ne babu jan tin a gefen ramin;tin beads suna ɓoye a cikin rami ta hanyar rami, don cimma gamsuwar abokin ciniki Abubuwan buƙatun ta hanyar toshe ramuka ana iya bayyana su azaman daban-daban, ƙayyadaddun tsari yana da tsayi musamman, kuma sarrafa tsarin yana da wahala.Sau da yawa ana samun matsaloli irin su asarar mai a lokacin hawan iska mai zafi da gwajin juriya na kore mai;fashewar mai bayan warkewa.Yanzu bisa ga ainihin yanayin samarwa, an taƙaita matakai daban-daban na toshe rami na PCB, kuma ana yin wasu kwatancen da bayani a cikin tsari, fa'idodi da rashin amfani:

Lura: Ka'idar aiki na daidaitawar iska mai zafi shine a yi amfani da iska mai zafi don cire abin da ya wuce kima a saman allon da aka buga da kuma cikin ramuka, sauran solder kuma an rufe su daidai a kan gammaye, layin da ba na juriya ba da saman. maki marufi, wanda shine hanyar jiyya ta saman allon da'ira da aka buga.daya.
    

1. Toshe tsarin rami bayan matakin zafi mai zafi
Gudun tsarin shine: abin rufe fuska na allo → HAL → ramin toshe → curing.Ana amfani da tsarin ba tare da toshewa ba don samarwa.Bayan an daidaita iska mai zafi, ana amfani da allon aluminum ko allon toshe tawada don kammala ta hanyar toshe rami na duk katangar da abokin ciniki ke buƙata.Tawada mai toshewa na iya zama tawada mai ɗaukar hoto ko tawada mai zafi.A cikin yanayin tabbatar da launi ɗaya na fim ɗin rigar, tawada mai toshewa ya fi dacewa don amfani da tawada iri ɗaya kamar saman allo.Wannan tsari na iya tabbatar da cewa ta rami ba ta sauke mai ba bayan an daidaita iska mai zafi, amma yana da sauƙi don haifar da tawada mai toshewa don gurɓata saman allon kuma ya zama rashin daidaituwa.Yana da sauƙi ga abokan ciniki su haifar da siyar da kama-da-wane (musamman a cikin BGA) lokacin hawa.Don haka yawancin abokan ciniki ba su yarda da wannan hanyar ba.


2. Toshe tsarin rami kafin matakin zafi mai zafi

2.1 Yi amfani da takardar aluminum don toshe ramuka, warkewa, da niƙa farantin don canja wurin tsari

A cikin wannan tsari, ana amfani da na'urar haƙowa ta CNC don fitar da takardar aluminum da ake buƙatar toshewa, yin farantin allo, sannan a toshe ramukan don tabbatar da cewa ramukan sun cika, kuma ana amfani da tawada don toshe ramin. ., Canjin raguwar resin ƙananan ƙananan ne, kuma ƙarfin haɗin gwiwa tare da bangon rami yana da kyau.Tsarin ya kwarara shine: pretreatment → toshe rami → farantin nika → canja wurin tsari → etching → allo surface solder mask

Wannan hanya za ta iya tabbatar da cewa ta hanyar rami toshe rami yana da lebur, kuma matakin iska mai zafi ba zai sami matsaloli masu inganci kamar fashewar mai da asarar mai a gefen ramin ba, amma wannan tsari yana buƙatar kauri na jan karfe na lokaci ɗaya, don haka. kaurin jan ƙarfe na bangon rami zai iya saduwa da ma'auni na abokin ciniki.Sabili da haka, abubuwan da ake buƙata don platin jan karfe a kan farantin duka suna da girma sosai, kuma akwai kuma manyan buƙatu don aikin injin niƙa don tabbatar da cewa an cire resin da ke saman tagulla gaba ɗaya, kuma saman jan ƙarfe yana da tsabta kuma ba shi da kariya daga. gurbacewa.Yawancin masana'antun PCB ba su da tsari mai kauri na lokaci ɗaya, kuma aikin kayan aikin bai cika buƙatun ba, wanda hakan ya sa ba a amfani da wannan tsari da yawa a masana'antar PCB.

2.2 Bayan toshe ramukan tare da zanen aluminum, kai tsaye duba mashin solder akan saman allo
A cikin wannan tsari, ana amfani da na'urar hakowa ta CNC don fitar da takardar aluminum da ake buƙatar toshe don yin farantin allo, wanda aka sanya akan na'urar buga allo don toshewa.Bayan an gama plugging, bai kamata a yi fakin ba fiye da mintuna 30.Gudun tsarin shine: pretreatment - toshe rami - siliki allo - pre-baking - fallasa - tasowa - curing

Wannan tsari zai iya tabbatar da cewa ta hanyar rami yana da kyau an rufe shi da man fetur, ramin toshe yana da lebur, kuma launi na fim ɗin rigar daidai ne.Pads, sakamakon rashin solderability;bayan zafi iska matakin, gefen ta via rami kumfa da man da aka cire.Yana da wuya a sarrafa samarwa ta amfani da wannan hanyar tsari, kuma dole ne injiniyan injiniya ya ɗauki matakai na musamman da sigogi don tabbatar da ingancin ramin toshe.


Me yasa allunan da'ira na PCB ke buƙatar toshe vias?

2.3 Bayan takardar aluminum ta toshe ramuka, haɓakawa, pre-cure, da niƙa allon, saman allo yana siyar da shi.
Yi amfani da injin hakowa na CNC don fitar da takardar aluminium wanda ke buƙatar ramukan toshe, yin farantin allo, da sanya shi akan na'urar bugu na allo don ramukan toshe.Dole ne ramukan filogi su cika, kuma bangarorin biyu sun fi dacewa suna fitowa.Tsarin gudana shine: pre-jiyya - toshe rami - pre-baking - ci gaba - pre-curing - jirgin saman solder mask

Domin wannan tsari yana ɗaukar maganin toshe rami don tabbatar da cewa ta rami ba za ta rasa mai ko fashe mai bayan HAL ba, amma bayan HAL, yana da wahala a warware matsalar gaba ɗaya ta tin bead a cikin rami da kwano a kan ramin. don haka da yawa abokan ciniki ba su yarda da shi.




2.4 Mashin solder akan saman jirgi da ramin toshe an kammala su a lokaci guda.
Wannan hanyar tana amfani da ragar allo na 36T (43T), wanda aka sanya akan na'urar buga allo, ta amfani da farantin baya ko gadon ƙusa, da toshe duk ta ramuka yayin kammala saman allo.Gudun tsarin shine: pretreatment - bugu na allo - - Pre-bake --Bayyana - - Ci gaba --Cre

Wannan tsari yana da ɗan gajeren lokaci da babban amfani da kayan aiki, wanda zai iya tabbatar da cewa ta hanyar ramukan ba zai rasa mai ba kuma ba za a yi tinned ta hanyar ramukan bayan hawan iska mai zafi ba., Iskar ta faɗaɗa kuma ta karye ta hanyar abin rufe fuska na solder, yana haifar da ɓarna da rashin daidaituwa.Za a sami ɗan ƙaramin adadin ta ramukan da ke ɓoye a cikin kwano yayin hawan iska mai zafi.A halin yanzu, mu kamfanin ya m warware ramin da unevenness na via rami bayan da yawa gwaje-gwaje, zabar iri daban-daban na tawada da danko, daidaita matsi na siliki allo bugu, da dai sauransu, da kuma wannan tsari da aka soma domin taro samar. .

      

                                                      2.00MM FR4+0.2MM PI m m PCB PCB Fitar Vias

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