Papa kaapuni kaapuni kiʻekiʻe e pili ana i ka hoʻohana ʻana i ka laulā laina maikaʻi, nā puka liʻiliʻi, ka laulā apo haiki (a i ʻole ka laulā apo), a me nā lua i kanu ʻia a makapō e loaʻa ai ke kiʻekiʻe kiʻekiʻe.A kiʻekiʻe precision 'o ia hoʻi ka hopena o ka " lahilahi, liʻiliʻi, haiki, lahilahi" e inevitably lawe mai kiʻekiʻe precision koi, e lawe i ka laina laula e like me ka laʻana: O. 20mm laina laula, e like me na rula e hana O. 16 ~ 0.24mm kūpono, ʻo ka hewa (O.20 ± 0.04) mm;a me O. No ka laula laina o 10mm, ka hewa (0.10±0.02) mm.ʻIke loa, ua pālua ʻia ka pololei o ka mea hope, a pēlā aku ʻaʻole paʻakikī ke hoʻomaopopo, no laila ʻaʻole e kūkākūkā kaʻawale ʻia nā koi kiʻekiʻe.Akā, he pilikia koʻikoʻi ia i ka ʻenehana hana. 
(1) ʻenehana uea maikaʻi
E hoʻololi ʻia ka laulā uea maikaʻi kiʻekiʻe e hiki mai ana mai 0.20mm-O.Hiki i ka 13mm-0.08mm-0.005mm ke hoʻokō i nā koi o SMT a me ka pūʻulu multi-chip (Multichip Package, MCP).No laila, pono nā ʻenehana ma lalo nei.
①E hoʻohana ana i ka ipu keleawe lahilahi a i ʻole ultra-thin copper foil (<18um) substrate a me ka ʻenehana lapaʻau maikaʻi. ②ʻO ka hoʻohana ʻana i nā kiʻiʻoniʻoni maloʻo lahilahi a me ke kaʻina hana kiʻi ʻoniʻoni, ʻoi aku ka maikaʻi o ka kiʻiʻoniʻoni maloʻo hiki ke hōʻemi i ka distortion ākea o ka laina a me nā hemahema.Hiki i ka lamination pulu ke hoʻopiha i nā āpau liʻiliʻi ea, hoʻonui i ka adhesion interfacial, a hoʻomaikaʻi i ka pono uea a me ka pololei. ③ Ke hoʻohana nei i ke kiʻi photoresist electrodeposited (Electro-deposited Photoresist, ED).Hiki ke hoʻomaluʻia kona mānoanoa ma ka laulā o 5-30 / um, hiki ke hana i nā uwea maikaʻi maikaʻi loa, kūpono loa no ka laulā apo haiki, ʻaʻohe laulā apo a me ka papa electroplating piha.I kēia manawa, ʻoi aku ma mua o ʻumi mau laina hana ED ma ka honua. ④Ke hoʻohana nei i ka ʻenehana hōʻike māmā like.No ka mea hiki i ka ʻike kukui like ke lanakila i ka mana o ka hoʻololi ʻana o ka laulā laina ma muli o ke kukui oblique o ke kumu kukui "point", hiki ke loaʻa nā uea maikaʻi me nā ana ākea laina pololei a me nā kihi maʻemaʻe.Eia nō naʻe, ʻoi aku ke kumukūʻai o nā lako hoʻolaha like ʻole, koi i ka hoʻopukapuka kiʻekiʻe, a koi i ka hana ma kahi ʻano maʻemaʻe kiʻekiʻe. ⑤ E hoʻohana i ka ʻenehana nānā ʻokoʻa (Automatic Optical Inspection, AOI).Ua lilo kēia ʻenehana i mea koʻikoʻi no ka ʻike ʻana i ka hana ʻana i nā uwea maikaʻi, a ke hāpai wikiwiki ʻia nei, hoʻohana ʻia a hoʻomohala ʻia.No ka la'ana, he 11 AoI ko ka Hui AT&T, a he 21 AoI ko ka Hui tadco i ho'ohana kūikawā 'ia e 'ike i nā ki'i o ka papa o loko. (2) ʻenehana Microvia
ʻO nā puka hana o nā papa paʻi i hoʻohana ʻia no ka hoʻopili ʻana i ka ʻili ke pāʻani nei i ke kuleana o ka pilina uila, kahi e ʻoi aku ka nui o ka noi ʻana o ka ʻenehana microvia.ʻO ka hoʻohana ʻana i nā mea drill bit maʻamau a me nā mīkini wili CNC e hana i nā lua liʻiliʻi he nui nā hemahema a me nā kumukūʻai kiʻekiʻe.No laila, ʻo ka densification o nā papa i paʻi ʻia ma muli o ka densification o nā uea a me nā pads.ʻOiai ua loaʻa nā hana nui, ua kaupalena ʻia kona hiki.No ka hoʻomaikaʻi hou ʻana i ka densification (e like me nā uea ma lalo o 0.08mm), wikiwiki ke kumukūʻai.lita, no laila e huli i ka hoʻohana ʻana i nā micropores e hoʻomaikaʻi i ka densification.
I nā makahiki i hala iho nei, ua hana ʻia nā holomua i ka mīkini wiliwili CNC a me ka ʻenehana micro-drill, no laila ua ulu wikiwiki ka ʻenehana micro-hole.ʻO kēia ka hiʻohiʻona nui i ka hana PCB o kēia manawa.I ka wā e hiki mai ana, ʻo ka ʻenehana o ka hana ʻana i nā lua liʻiliʻi e hilinaʻi nui ʻia i nā mīkini wili CNC kiʻekiʻe a me nā poʻo liʻiliʻi maikaʻi loa, ʻoiai ʻo nā lua i hana ʻia e ka ʻenehana laser ʻoi aku ka haʻahaʻa i nā mea i hana ʻia e nā mīkini wili CNC mai ka manaʻo o ke kumukūʻai a me ka maikaʻi o ka lua. . ①CNC drilling machine I kēia manawa, ua hana ka ʻenehana o CNC drilling machine i nā holomua hou a me ka holomua.A hoʻokumu i kahi hanauna hou o CNC drilling machine i hōʻike ʻia e ka wili ʻana i nā lua liʻiliʻi.ʻO ka maikaʻi o ka hoʻoheheʻe ʻana i nā lua liʻiliʻi (ma lalo o 0.50mm) e ka mīkini hoʻoheheʻe micro-hole he 1 mau manawa kiʻekiʻe ma mua o ka mīkini hoʻoheheʻe CNC maʻamau, me ka liʻiliʻi o nā hemahema, a ʻo ka wikiwiki o ka rotation he 11-15r / min;hiki iā ia ke wili i ka O. 1 ~ 0.2mm micro-hole, hoʻohana ʻia nā mea hoʻoheheʻe liʻiliʻi kiʻekiʻe me ka ʻike cobalt kiʻekiʻe, a hiki ke hoʻopaʻa ʻia ʻekolu mau papa (1.6mm / poloka) no ka wili.Ke haʻihaʻi ka pahu drill, hiki iā ia ke hoʻokuʻu a hōʻike i ke kūlana, hoʻololi i ka drill bit a nānā i ke anawaena (hiki i ka makasina mea hana ke hoʻokomo i nā haneli haneli), a hiki ke hoʻomalu i ka mamao mau ma waena o ka piko drill a me ka uhi. papa a me ka hohonu wili, no laila hiki ke wili ʻia nā puka makapō., a ʻaʻole e hōʻino i ka countertop.Hoʻohana ka papa ʻaina ʻo CNC drilling machine i ka ea cushion a me ka magnetic floating type, e neʻe wikiwiki ana, ʻoi aku ka māmā a me ka pololei, ʻaʻole e ʻoki i ka papaʻaina.ʻAʻole lawa kēia mau mīkini drill i kēia manawa, e like me ka Mega 4600 mai Prute i Italia, ka ExcelIon 2000 series ma United States, a me nā huahana hou mai Switzerland a me Kelemānia. ② He nui nā pilikia me ka ʻeli ʻana i ka laser i nā mīkini wili CNC maʻamau a me nā drills e wili i nā puka liʻiliʻi.Ua keakea ia i ka holomua o ka micro hole 'enehana, no laila, laser hole etching ua uku noonoo, noiʻi a me ka noi.Akā, aia kahi pōʻino make, ʻo ia hoʻi, ka hoʻokumu ʻana o nā puka pepeiaohao, i hoʻonui ʻia me ka piʻi ʻana o ka mānoanoa pā.Ma waho aʻe o ka haumia o ka ablation wela kiʻekiʻe (ʻo ia hoʻi nā papa multi-layer), ke ola a me ka mālama ʻana i ke kumu kukui, ka hoʻihoʻi hou ʻana o ka lua etching a me ke kumukūʻai, ka hoʻolaha ʻana a me ka hoʻohana ʻana i nā lua micro i ka hana ʻana i nā papa paʻi. i kaupalena ʻia.Eia nō naʻe, hoʻohana ʻia ka laser ablation i nā microplates lahilahi a kiʻekiʻe, ʻoi aku hoʻi i ka ʻenehana high-density interconnect (HDI) o MCM-L, e like me M. c.Ua hoʻohana ʻia i ka interconnection kiʻekiʻe kiʻekiʻe e hui pū ana i ka kiʻiʻoniʻoni polyester etching ma Ms a me ka deposition metala (sputtering technique).Hiki ke hoʻohana ʻia ke kanu ʻia ma o ka hoʻokumu ʻana i nā papa multilayer kiʻekiʻe kiʻekiʻe me ke kanu ʻia a me ka makapō ma o nā hale.Eia nō naʻe, ma muli o ka hoʻomohala ʻana a me nā ʻenehana ʻenehana o nā mīkini drilling CNC a me nā puʻupuʻu liʻiliʻi liʻiliʻi, ua hoʻolaha a hoʻohana ʻia lākou.Pela ka laser wili lua ma ka ili ʻAʻole hiki i nā noi ma nā papa kaapuni i kau ʻia ke aupuni.Aia nō naʻe kahi wahi ma kekahi kahua. ③Ka ʻenehana i kanu ʻia, makapō a i loko o ka lua ʻO ka hui pū ʻana o ka ʻenehana kanu ʻia, makapō a me nā puka puka he ala nui hoʻi ia e hoʻomaikaʻi ai i ke kiʻekiʻe kiʻekiʻe o nā kaapuni paʻi.ʻO ka maʻamau, he mau puka liʻiliʻi ke kanu ʻia a me nā ala makapō.Ma waho aʻe o ka hoʻonui ʻana i ka helu o nā wirings ma ka papa, ua hoʻopili ʻia nā vias i kanu ʻia a me nā makapō ma waena o nā "kokoke" i loko o nā papa, kahi e hōʻemi nui ai i ka helu o nā puka i hana ʻia, a ʻo ka hoʻonohonoho ʻana o ka disc kaʻawale e hoʻemi nui i ka helu o vias.Hoʻemi ʻia, ma laila e hoʻonui ai i ka nui o nā wili a me nā interlayer interconnections i ka papa, a me ka hoʻomaikaʻi ʻana i ka kiʻekiʻe kiʻekiʻe o nā interconnections.No laila, ʻo ka papa multi-layer me ka hui pū ʻana o ka kanu ʻana, ka makapō a me ka puka ma ka liʻiliʻi he 3 mau manawa kiʻekiʻe ma mua o ka papa hana maʻamau āpau ma lalo o ka nui like a me ka helu o nā papa.ʻO ka nui o ka papa paʻi i hui pū ʻia me nā puka e hoʻemi nui ʻia a i ʻole e hoʻemi nui ʻia ka helu o nā papa.No laila, ma nā papa paʻi kiʻekiʻe kiʻekiʻe, kanu ʻia a makapō ma o nā ʻenehana, ʻaʻole wale ma nā papa i paʻi ʻia ma luna o nā kamepiula nui, nā lako kamaʻilio, a me nā mea ʻē aʻe, akā i nā noi kīwila a me nā ʻoihana.Ua hoʻohana nui ʻia i loko o ke kula o , a i loko o kekahi mau papa lahilahi, e like me nā papa lahilahi me nā papa ʻeono o nā PCMCIA, Smart, IC kāleka, etc. ʻO ka nā papa kaapuni i pai ʻia me ka lua i kanu ʻia a makapō Hoʻopau maʻamau nā hale e ke ʻano hana "split board", ʻo ia ka mea hiki ke hoʻopau wale ʻia ma hope o nā manawa he nui o ke kaomi ʻana, wili, hole plating, etc., no laila he mea koʻikoʻi ka hoʻonohonoho pololei.. 
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