Ngophuhliso olukhawulezayo lweemodyuli zeemoto zombane kunye neemodyuli zonxibelelwano lwamandla, iibhodi zesekethe yefoyile yobhedu ye-12oz nangaphezulu ngokuthe ngcembe ziye zaba luhlobo lweebhodi ezikhethekileyo zePCB ezinethemba lemarike ebanzi, eziye zatsala ingqalelo kunye nengqalelo yabavelisi ngakumbi;Ngokusetyenziswa ngokubanzi kwe iibhodi zesekethe eziprintiweyo kwintsimi ye-elektroniki, iimfuno zokusebenza kwezixhobo ziya phezulu nangaphezulu.Iibhodi zesekethe eziprintiweyo aziyi kubonelela kuphela uqhagamshelo lombane oluyimfuneko kunye nenkxaso yomatshini kumacandelo e-elektroniki, kodwa ngokuthe ngcembe zinikwe ngakumbi Ngemisebenzi eyongezelelweyo, iibhodi eziprintiweyo zefoyile yobhedu ezinokudibanisa imithombo yamandla, zibonelela ngokuphezulu kunye nokuthembeka okuphezulu ngokuthe ngcembe ziye zaduma. iimveliso eziphuhliswe kushishino PCB kwaye babe namathemba abanzi.

Okwangoku, abasebenzi bophando kunye nophuhliso kushishino baye baphuhlisa ngempumelelo a ibhodi yesekethe eprintiweyo kabini ngobungqingqwa bekopolo obugqityiweyo obuyi-10oz ngendlela engqindililiyo yokutyeba okulandelelanayo kokutshona kobhedu lwe-electroplated + uncedo lokuprinta imaski ye-solder ezininzi.Nangona kunjalo, kukho iingxelo ezimbalwa malunga nokuveliswa kobhedu olutyebileyo iibhodi eziprintiweyo ezininzi ngobunzima bobhedu obugqityiweyo be-12oz nangaphezulu;eli nqaku ikakhulu lijolise kuphononongo lokwenzeka kwenkqubo yemveliso ye-12oz ultra-thick copper multilayer printed boards.Itekhnoloji yobhedu etyebileyo engqindilili elawulwa ngokunzulu itekhnoloji yokufaka itekhnoloji + itekhnoloji yokwakhiwa kwe-lamination, iqonda ngokusebenzayo ukusetyenzwa kunye nokuveliswa kwe-12oz ye-ultra-thick copper multilayer printed boards.

Inkqubo yokuvelisa

2.1 Uyilo oluqokelelweyo

Lo ngumaleko o-4, Ubukhulu bangaphandle / bangaphakathi be-cooper 12 oz, ububanzi bemin / isithuba 20/20mil, beka phezulu nje ngasezantsi:

2.1 Uhlalutyo lweengxaki zokucubungula

❶ Itekhnoloji yokukrolwa kobhedu engqindilili kakhulu (ifoyile yobhedu ingqindilili kakhulu, kunzima ukuyibhala): thenga imathiriyeli yefoyile yobhedu ekhethekileyo eyi-12OZ, usebenzise itekhnoloji yokukrola enzulu elawulwa kakuhle kunye nengalunganga ukuze uqonde ukubanjwa kweesekethe zobhedu ezityebe kakhulu.

❷ Itekhnoloji ye-Ultra-thick copper lamination: Itekhnoloji ye-single-side-controlled circuit-controlled deep etching by vacuum pressing and filling isetyenziselwa ukunciphisa ngokufanelekileyo ubunzima bokucinezela.Kwangaxeshanye, inceda ukucofa i-silicone pad + epoxy pad ukusombulula ingxaki ye-ultra-thick copper laminate Iingxaki zobugcisa ezifana namabala amhlophe kunye ne-lamination.

❸ Ulawulo oluchanekileyo lweendlela ezimbini zokulungelelaniswa komgangatho ofanayo wemigca: umlinganiselo wokwandiswa kunye nokucuthwa emva kokulaliswa, ukulungiswa kwembuyekezo yokwandiswa kunye nokucutha komgca;ngelo xesha, imveliso yomgca isebenzisa i-LDI laser imaging ngqo ukuze kuqinisekiswe ukuchaneka kokuchaneka kwemizobo emibini.

❹ Itekhnoloji yokomba yobhedu etyebileyo kakhulu: Ngokukhulisa isantya sokujikeleza, isantya sokutya, isantya sokuhlehla, ubomi bokomba, njl.njl., ukuqinisekisa umgangatho olungileyo wokomba.

2.3 Inkqubo yokuhamba (thatha ibhodi enemigangatho emi-4 njengomzekelo)

2.4 Inkqubo

Ngenxa yefoyile yobhedu etyebileyo, akukho bhodi yobhedu eyi-12oz etyebileyo kushishino.Ukuba ibhodi engundoqo igxininiswe ngokuthe ngqo kwi-12oz, i-etching yesekethe inzima kakhulu, kwaye umgangatho we-etching kunzima ukuqinisekiswa;ngelo xesha, ubunzima bokucinezela isiphaluka emva kokubunjwa kwexesha elilodwa nako kwanda kakhulu., Ukujongana ne-bottleneck enkulu yobugcisa.

Ukuze ucombulule ezi ngxaki zingasentla, kule mveliso yobhedu ye-ultra-thick, i-copper ekhethekileyo ye-12oz ithengwa ngokuthe ngqo ngexesha loyilo lwesakhiwo.Isekethe ithatha itekhnoloji elawulwa ngokunzulu, oko kukuthi, ifoyile yobhedu iqale ibekwe 1/2 ubukhulu kwicala elingasemva → icinezelwe ukwenza ibhodi yobhedu eshinyeneyo → ukukrolwa ngaphambili ukufumana umaleko wangaphakathi. ipateni yesekethe.Ngenxa ye-etching step-by-step, ubunzima be-etching buncitshiswe kakhulu, kwaye ubunzima bokucinezela buyancipha.

❶ uyilo lwefayile yomgca
Iisethi ezimbini zeefayile zenzelwe umaleko ngamnye wesekethe.Ifayile yokuqala engalunganga kufuneka ibonakaliswe ukuze kuqinisekiswe ukuba isiphaluka sikwindawo efanayo ngexesha lokulawula phambili / ukubuyisela ukubuyisela ubunzulu, kwaye akuyi kubakho ukungahambi kakuhle.

❷ Ukubuyisela umva umva ukuchongwa okunzulu kwemizobo yesekethe

❸ Ulawulo lokuchaneka kolungelelwaniso lwemizobo yesekethe yesibini
Ukuze kuqinisekiswe ukuhambelana kwemigca emibini, ixabiso lokwandiswa kunye nokunciphisa kufuneka lilinganiswe emva kwe-lamination yokuqala, kunye nokwandiswa komgca kunye nembuyekezo yokunciphisa kufuneka ilungiswe;ngaxeshanye,

Ukulungelelaniswa ngokuzenzekelayo kwe-LDI laser imaging iphucula ngokufanelekileyo ukuchaneka kokulungelelaniswa.Emva kokulungiswa, ukuchaneka kokulungelelaniswa kunokulawulwa ngaphakathi kwe-25um.

❹ Ukulawula umgangatho wokopolo otyebileyo
Ukuze kuphuculwe umgangatho we-etching ye-ultra-thick copper circuits, iindlela ezimbini ze-alkaline etching kunye ne-asidi etching zisetyenziselwe uvavanyo lokuthelekisa.Emva kokuqinisekiswa, i-acid-etched circuit inee-burrs ezincinci kunye nokuchaneka kobubanzi bomgca ophezulu, onokuhlangabezana neemfuno ze-etching yobhedu olutyebileyo.Isiphumo siboniswe kwiThebhile 1.

Kunye iingenelo inyathelo-by-nyathelo elawulwa etching nzulu, nangona ubunzima lamination iye yancitshiswa kakhulu, ukuba indlela eqhelekileyo isetyenziselwa lamination, isajongene iingxaki ezininzi, kwaye kulula ukuvelisa iingxaki ezifihlakeleyo umgangatho ezifana lamination. amabala amhlophe kunye lamination delamination.Ngenxa yesi sizathu, emva kovavanyo lothelekiso lwenkqubo, ukusetyenziswa kwe-silicone pad pressing kunokunciphisa amabala amhlophe amhlophe, kodwa umphezulu webhodi awulingani nokusabalalisa ipateni, echaphazela ukubonakala kunye nomgangatho wefilimu;ukuba i-epoxy pad nayo iyancediswa, umgangatho wokucinezela uphuculwe kakhulu , Unokuhlangabezana neemfuno ezixinzelelekileyo zobhedu olutyebileyo.

❶ Indlela yobhedu engqindilili kakhulu yokulambisa

❷ Umgangatho we-laminate yekopolo etyebileyo

Ukuqwalasela imeko yamacwecwe alaminated, isiphaluka sigcwaliswe ngokupheleleyo, ngaphandle kwe-bubbles micro-slit, kwaye yonke inxalenye enzulu igxininise kakhulu kwi-resin;Kwangaxeshanye, ngenxa yengxaki yokutyeba kwicala lekopolo elityebileyo, ububanzi bomgca ophezulu bukhulu kakhulu kunobubanzi bomgca obumxinwa phakathi phakathi Malunga ne-20um, le milo ifana "neleli eguquliweyo", eya kuphucula ngakumbi ukubamba ukucinezela, nto leyo eyothusayo.

❷ Itekhnoloji yokwakhiwa kobhedu olutyebe kakhulu

Ukusebenzisa itekhnoloji echazwe ngasentla echazwe ngasentla ngetekhnoloji ye-etching enzulu + inkqubo yokuthambisa, iileya zingongezwa ngokulandelelana ukuze kuqatshelwe ukusetyenzwa nokuveliswa kweebhodi eziprintiweyo zobhedu ezinomaleko amaninzi;ngelo xesha, xa umaleko wangaphandle wenziwa, ubukhulu bobhedu bumalunga ne-approx kuphela.I-6oz, kuluhlu lwenkqubo ye-mask ye-solder yesiqhelo, inciphisa kakhulu ubunzima benkqubo yokuvelisa imaski ye-solder kunye nokunciphisa umjikelo wemveliso ye-mask ye-solder.

Iiparamitha zokomba zobhedu ezityebileyo

Emva koxinzelelo olupheleleyo, ubukhulu beplate egqityiweyo yi-3.0mm, kwaye ubukhulu bobhedu jikelele bufikelela kwi-160um, okwenza kube nzima ukubhola.Ngeli xesha, ukwenzela ukuba kuqinisekiswe umgangatho wokugaya, iiparitha zokugaya zilungiswe ngokukodwa kwindawo.Emva kokulungelelaniswa, uhlalutyo lwesilayi lubonise ukuba i-drilling ayinaziphene ezifana neentloko ze-nail kunye nemingxuma enqabileyo, kwaye umphumo ulungile.

Isishwankathelo
Ngophando lwenkqubo kunye nophuhliso lwebhodi eprintiweyo ye-ultra-thick copper multilayer, kusetyenziswa itekhnoloji yetekhnoloji echanekileyo kunye nengalunganga elawulwayo, kwaye i-silicone pad + epoxy pad isetyenziselwa ukuphucula umgangatho we-lamination ngexesha lokutshiza, esombulula ngempumelelo Ubunzima bokufaka isiphaluka sobhedu esityebileyo Iingxaki zobugcisa eziqhelekileyo kushishino, ezifana neendawo ezimhlophe ezityebileyo ze-laminate kunye noshicilelo oluninzi lwemaski ye-solder, ziye zaqonda ngempumelelo ukusetyenzwa nokuveliswa kweebhodi eziprintiweyo zobhedu olutyebileyo;ukusebenza kwayo kuye kwaqinisekiswa ukuba inokuthenjwa, kwaye iye yanelisa iimfuno ezikhethekileyo zabathengi okwangoku.

❶ Lawula itekhnoloji yenyathelo nenyathelo nzulu kwimigca eyakhayo nengalunganga: ukusombulula ngempumelelo ingxaki yokukrolwa komgca wobhedu otyebileyo;
❷ Ithekhinoloji yolawulo lokuchaneka kolungelelwaniso oluncomekayo nolungalunganga: ukuphucula ngokufanelekileyo ukuchaneka kokuchaneka kwemizobo emibini;
❸ Itekhnoloji yokulamisa yokwakhiwa kobhedu etyebileyo: iqonda ngokufanelekileyo ukusetyenzwa kunye nokuveliswa kweebhodi eziprintiweyo ezininzi zobhedu.

Ukuqukumbela
Iibhodi eziprintiweyo zobhedu ezityebileyo zisetyenziswa ngokubanzi kwiimodyuli zolawulo lwamandla ezixhobo ezinkulu ngenxa yokusebenza kwazo ngokugqithisileyo.Ngokukodwa ngophuhliso oluqhubekayo lwemisebenzi ebanzi, iibhodi eziprintiweyo zobhedu ezityebileyo zibophelelekile ukuba zijongane namathemba abanzi eMarike.Eli nqaku lenzelwe kuphela ireferensi kunye nereferensi kubalingane.