Nabani na obandakanyekayo kwibhodi yesekethe eprintiweyo ( PCB ) ishishini liyaqonda ukuba iiPCB zinemiphetho yobhedu kumphezulu wazo.Ukuba zishiywe zingakhuselekanga ngoko ubhedu luya ku-oxidize kwaye luwohloke, okwenza ibhodi yesekethe ingasebenzi.Ukugqitywa komphezulu kwenza ujongano olubalulekileyo phakathi kwecandelo kunye nePCB.Ukugqitywa kunemisebenzi emibini ebalulekileyo, ukukhusela i-circuitry copper eveziweyo kunye nokubonelela nge-solderable surface xa kuhlanganiswa (i-soldering) amacandelo kwibhodi yesekethe eprintiweyo.

HASL / Khokela iHASL yasimahla

I-HASL yeyona nto iphambili ekugqityweni komphezulu osetyenziswa kushishino.Inkqubo ibandakanya ukuntywiliselwa iibhodi zesekethe kwimbiza etyhidiweyo yenkcenkce/yelothe ingxubevange kwaye emva koko kususwe i-solder engaphezulu ngokusebenzisa 'iimela zomoya', ezivuthela umoya oshushu kumphezulu webhodi.

Enye yeenzuzo ebezingalindelekanga zenkqubo ye-HASL kukuba iya kuveza i-PCB kumaqondo obushushu ukuya kuthi ga kwi-265°C eya kuchonga nayiphi na imiba enokubakho ye-delamination kakuhle phambi kokuba naziphi na izinto ezibizayo zincanyathiselwe ebhodini.

I-HASL Igqitywe Ibhodi yeSekethe eShicileleyo emacaleni amabini

Izinto eziluncedo:

• Ixabiso eliphantsi
• Ifumaneka ngokubanzi
• Ukuphinda kusetyenzwe
• Ubomi beShelf obugqwesileyo

Izinto ezingeloncedo:

• Imiphezulu engalinganiyo
• Ayilunganga kwiPitch eNgcono
• Iqulathe iLead (HASL)
• I-Thermal Shock
• Solder Bridging
• Iplagi okanye iNcitshisiwe ye-PTH's (Icandwe ngomngxunya)

Ukuntywiliselwa kwiTin

Ngokutsho kwe-IPC, i-Association Connecting Electronics Industry, i-Immersion Tin (ISn) yintsimbi egqityiweyo ediphozithwa yi-chemical displacement reaction ethi igalelwe ngqo phezu kwesiseko sesinyithi sebhodi yesekethe, oko kukuthi, ubhedu.I-ISn ikhusela ubhedu olungaphantsi kwi-oxidation ngaphezu kobomi obucetyiweyo beshelufu.

Ubhedu kunye ne-tin nangona kunjalo zinobudlelwane obuqinileyo omnye komnye.Ukusasazwa kwesinye isinyithi kwelinye kuya kwenzeka ngokungenakunqandwa, kuchaphazela ngokuthe ngqo ixesha leshelufu yediphozithi kunye nokusebenza kokugqiba.Iziphumo ezibi zokukhula kwentshebe zichazwe kakuhle kuncwadi olunxulumene noshishino kunye nezihloko zamaphepha amaninzi apapashiweyo.

Izinto eziluncedo:

• Umphezulu oMcaba
• Hayi Pb
• Ukuphinda kusetyenzwe
• UKhetho oluPhezulu lokuFaka iPin yeFit

Izinto ezingeloncedo:

• Kulula ukubangela ukuPhathwa komonakalo
• Inkqubo isebenzisa iCarcinogen (Thiourea)
• I-Tin eveziweyo kwiNdibano yokuGqibela inokuMhlwa
• Ii-Tin Whiskers
• Ayilunganga kwiiNkqubo zokuVela kwakhona/kweNdibano ezininzi
• Kunzima Ukulinganisa Ukutyeba

Ukuntywiliselwa kwesilivere

Isilivere yokuntywiliselwa yikhemikhali engeyiyo eye-electrolytic egqitywe ngokuntywiliselwa iPCB yobhedu kwitanki yeeyoni zesilivere.Lukhetho olulungileyo lokugqitywa kweebhodi zesekethe ezine-EMI shieldingand ikwasetyenziselwa uqhagamshelwano lwedome kunye nokudibanisa ucingo.Umyinge wobunzima bomphezulu wesilivere yi-5-18 microinches.

Ngeenkxalabo zale mihla zokusingqongileyo ezinje nge-RoHS kunye ne-WEE, isilivere yokuntywiliselwa ingcono ngokusingqongileyo kune-HASL kunye ne-ENIG.Iyathandwa nangenxa yeendleko zayo ezincinci kune-ENIG.

Izinto eziluncedo:

• Isebenza ngokulinganayo kune-HASL
• Ngokusingqongileyo ngcono kune-ENIG kunye ne-HASL
• Ubomi beShelufu bulingana ne-HASL
• Ixabisa ngakumbi kune-ENIG

Izinto ezingeloncedo:

• Kufuneka ithengiswe phakathi kosuku i-PCB isusiwe kwindawo yokugcina
• Inokungcoliswa ngokulula ngokuphathwa ngendlela engafanelekanga
• Ihlala ixesha elide kune-ENIG ngenxa yokuba akukho maleko yenickel ngaphantsi

OSP / Entek

I-OSP (i-Organic Solderability Preservative) okanye i-anti-tarnish igcina umphezulu wobhedu kwi-oxidation ngokufaka umaleko obhityileyo okhuselayo wezinto phezu kobhedu oluveziweyo ngokuqhelekileyo kusetyenziswa inkqubo yokuhanjiswa.

Isebenzisa i-compound ye-organic-based based organic compounds ekhethiweyo ngokudibanisa nobhedu kwaye inikezela ngomgca we-organometallic okhusela ubhedu ngaphambi kokuba udibanise.Ikwaluhlaza ngokugqithisileyo kokusingqongileyo xa kuthelekiswa nezinye izinto eziqhelekileyo ezingenalo ilothe, ezinengxaki yokuba netyhefu okanye ukusetyenziswa kwamandla okuphezulu kakhulu.

Izinto eziluncedo:

• Umphezulu oMcaba
• Hayi Pb
• Inkqubo elula
• Ukuphinda kusetyenzwe
• Isebenza kakuhle emalini

Izinto ezingeloncedo:

• Akukho Ndlela Yokulinganisa Ukutyeba
• Ayilunganga kwi-PTH (iPlated ngokusebenzisa imingxunya)
• Ubomi beShelufu obufutshane
• Inokubangela imiba ye-ICT
• I-Cu eveziweyo kwiNdibano yokuGqibela
• Ukubamba Ngovakalelo

I-Electroless Nickel Immersion Gold (ENIG)

I-ENIG inamaleko amabini entsimbi ye-2-8 μin Au ngaphezu kwe-120-240 μin Ni.I-Nickel ngumqobo kubhedu kwaye ngumphezulu apho amacandelo athengiswe kuwo.Igolide ikhusela i-nickel ngexesha lokugcinwa kwaye inika ukuchasana koqhagamshelwano oluphantsi olufunekayo kwiidiphozithi zegolide ezincinci.I-ENIG ngoku ngokungathandabuzekiyo sesona sigqityiweyo sisetyenziswayo kwishishini le-PCB ngenxa yokukhula kunye nokuphunyezwa kommiselo we-RoHs.

Ibhodi yeSekethe eprintiweyo eneChem Gold Surface Finish

Izinto eziluncedo:

• Umphezulu oMcaba
• Hayi Pb
• Ilungile kwi-PTH (iPlated ngokusebenzisa imingxunya)
• Ubomi beShelf ende

Izinto ezingeloncedo:

• Iyabiza
• Ayisebenzi kwakhona
• I-Pad emnyama / iNickel emnyama
• Umonakalo ovela kwi-ET
• Ilahleko yoMqondiso (RF)
• Inkqubo Enzima

I-Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)

U-ENEPIG, isizalwana esandula ukufika kwihlabathi lebhodi yesekethe, waqala weza kwimarike ngasekupheleni kweminyaka yama-90.Olu tyalo-zintlu-ntathu lwesinyithi lwe-nickel, i-palladium, kunye negolide lubonelela ngokhetho olufana nolunye: luyaboleka.Ukuqhekeka kokuqala kwe-ENEPIG kwibhodi yesekethe eprintiweyo kunyango lomphezulu owenziweyo owenziweyo ngenxa yomgangatho wexabiso eliphezulu kakhulu lepalladium kunye nemfuno ephantsi yokusetyenziswa.

Imfuno yomgca wokuvelisa owahlukileyo ayizange yamkeleke kwezi zizathu zinye.Kutshanje, i-ENEPIG yenze imbuyekezo njengamandla okuhlangabezana nokuthembeka, iimfuno zokupakisha, kunye nemigangatho ye-RoHS idibanisa noku kugqitywa.Ifanelekile kwizicelo zefrikhwensi ephezulu apho isithuba silinganiselwe.

Xa kuthelekiswa nezinye iziqendu ezine eziphezulu, i-ENIG, i-Lead Free-HASL, isilivere yokuntywila kunye ne-OSP, i-ENEPIG idlula yonke into kwinqanaba lokugqwala emva kwe-assembly.

Izinto eziluncedo:

• Umphezulu oMcaba kakhulu
• Akukho mxholo okhokelayo
• INdibano yeMijikelo emininzi
• IiJoyinti zeSolder ezigqwesileyo
• Ngocingo Bondable
• Akukho Mingcipheko yokuRhakala
• Inyanga eyi-12 okanye ngaphezulu Ubomi beShelufu
• Akukho Mngcipheko wePad emnyama

Izinto ezingeloncedo:

• KuseKubi kakhulu
• Iyasetyenzwa kwakhona kunye neminye imida
• IMida yokuLungiselela

Igolide - iGolide eNqinileyo

IHard Electrolytic Gold iqulathe umaleko wegolide obekwe phezu kwedyasi yesithintelo senikeli.Igolide eqinileyo yomelele ngokugqithisileyo, kwaye idla ngokusetyenziswa kwiindawo ezinxitywayo eziphezulu njengeminwe edityanisiweyo kunye neephedi zamaqhosha.

Ngokungafaniyo ne-ENIG, ubukhulu bayo bunokwahluka ngokulawula ubude bomjikelo we-plating, nangona amaxabiso asezantsi eminwe ayi-30 μin yegolide ngaphezulu kwe-100 μin nickel kuKlasi loku-1 kunye noKlasi 2, 50 μin yegolide ngaphezulu kwe-100 μin nickel yeKlasi yesi-3.

Igolide elukhuni ayisetyenziswa ngokubanzi kwiindawo ezithengiswayo, ngenxa yeendleko zayo eziphezulu kunye nokungabikho kokuthengiswa kwayo.Ubukhulu bobukhulu obuthathwa yi-IPC njengobunokuthengiswa yi-17.8 μin, ngoko ke ukuba olu hlobo lwegolide kufuneka lusetyenziswe kwindawo eza kuthengiswa, ukutyeba okucetyiswayo kufanele kube malunga ne-5-10 μin.

Izinto eziluncedo:

• Umphezulu Onzima, Ohlala ixesha elide
• Hayi Pb
• Ubomi beShelf ende

Izinto ezingeloncedo:

• Ibiza kakhulu
• ULungiselelo oloNgezelelweyo/Umsebenzi onzima
• Ukusetyenziswa kwe-Resist / Tape
• IiPlating / iiBha zebhasi ziyafuneka
• Ukucandwa kwemida
• Ubunzima kunye nezinye iziGqibo zoMphezulu
• I-Undercut ye-Etching inokukhokelela kwi-Slivering / Flaking
• Ayithengiswa Ngaphezulu kwe-17 μin
• Gqiba Ayifaki Ngokugcweleyo i-Trace Sidewalls, Ngaphandle kweeNdawo zeFinger

Ngaba ujonge indawo eKhethekileyo yokuGqibela iBhodi yakho yeSekethe?