Noma ubani othintekayo ngaphakathi kwebhodi lesekethe eliphrintiwe ( PCB ) imboni iyaqonda ukuthi ama-PCB ane-copper finishes ebusweni bawo.Uma zishiywe zingavikelekile khona-ke ithusi lizokhipha i-oxidize futhi liwohloke, okwenza ibhodi lesifunda lingasebenzi.Isiphetho esingaphezulu sakha ukusebenzelana okubalulekile phakathi kwengxenye ne-PCB.Isiphetho sinemisebenzi emibili ebalulekile, ukuvikela ukujikeleza kwethusi okuveziwe nokuhlinzeka indawo ethengiswayo lapho kuhlanganiswa (i-soldering) izingxenye ebhodini lesifunda eliphrintiwe.

I-HASL / Lead Free HASL

I-HASL iwukuphela kwendawo ehamba phambili esetshenziswa embonini.Le nqubo iqukethe ukucwiliswa kwamabhodi esekethe ebhodweni elincibilikisiwe le-tin/lead alloy bese ekhipha i-solder eyeqile ngokusebenzisa 'imimese yomoya', ephephetha umoya oshisayo ebusweni bebhodi.

Enye yezinzuzo ezingahlosiwe zenqubo ye-HASL ukuthi izodalula i-PCB emazingeni okushisa afika ku-265°C okuzohlonza noma yiziphi izinkinga ezingase zibe khona ze-delamination kahle ngaphambi kokuba noma yiziphi izingxenye ezibizayo zinamathiselwe ebhodini.

I-HASL Iqedile Ibhodi Lesifunda Eliphrintiwe Ngamaceleni Akabili

Izinzuzo:

• Izindleko eziphansi
• Itholakala Ngokubanzi
• Isebenza kabusha
• Impilo Yeshelufu Enhle Kakhulu

Ububi:

• Indawo Engalingani
• Ayilungele i-Fine Pitch
• Iqukethe ukuhola (HASL)
• I-Thermal Shock
• I-Solder Bridging
• Ama-PTH axhunyiwe noma ancishisiwe (Afakwe Ngezimbobo)

I-Tin yokucwiliswa

Ngokusho kwe-IPC, i-Association Connecting Electronics Industry, i-Immersion Tin (ISn) iwukuphela kwensimbi efakwa ukusabela kokushintshwa kwamakhemikhali okusetshenziswa ngokuqondile phezu kwesisekelo sensimbi yebhodi lesekethe, okungukuthi, ithusi.I-ISn ivikela ithusi elingaphansi ekufakweni kwe-oxid ngesikhathi seshalofu elihlosiwe.

Ithusi nethini nokho kunokuhlobana okuqinile.Ukusatshalaliswa kwensimbi kwenye kuzokwenzeka ngokungenakugwenywa, kuthinte ngqo isikhathi seshelufu sediphozithi kanye nokusebenza kokuphothula.Imiphumela emibi yokukhula kwentshebe kathayela ichazwa kahle ezincwadini ezihlobene nezimboni kanye nezihloko zamaphepha amaningana ashicilelwe.

Izinzuzo:

• I-Flat Surface
• Ayikho i-Pb
• Isebenza kabusha
• Inketho ephezulu yokufakwa kwephinikhodi ye-Fit Fit

Ububi:

• Kulula Ukubangela Ukonakala Kokusingatha
• Inqubo isebenzisa i-Carcinogen (Thiourea)
• Ithini Eliveziwe Ekuhlanganiseni Kokugcina lingagqwala
• Ama-tin Whiskers
• Ayilungele Izinqubo Eziningi Zokugeleza Kabusha/zokuhlangana
• Kunzima Ukukala Ubukhulu

Isiliva Sokucwiliswa

Isiliva lokucwiliswa liwukuphela kwekhemikhali engeyona eye-electrolytic esetshenziswa ngokucwilisa i-PCB yethusi ethangini lama-ion esiliva.Kungukukhetha okuhle kokuqedwa kwamabhodi wesekethe ane-EMI shieldingand iphinde isetshenziselwe othintana nabo bedome kanye nokubopha ngentambo.Ubukhulu obuphakathi besiliva bungama-microinches angu-5-18.

Ngokukhathazeka kwesimanje kwezemvelo okufana ne-RoHS ne-WEE, isiliva lokucwiliswa lingcono ngokwezemvelo kunokokubili i-HASL ne-ENIG.Iyathandwa futhi ngenxa yezindleko zayo eziphansi kune-ENIG.

Izinzuzo:

• Isebenza ngokulinganayo kune-HASL
• Imvelo ingcono kune-ENIG ne-HASL
• Impilo yeshelufu ilingana ne-HASL
• Ibiza kakhulu kune-ENIG

Ububi:

• Kumele ithengiswe phakathi nosuku i-PCB ekhishwa ngalo endaweni yokugcina
• Ingangcoliswa kalula ngokuphathwa okungafanele
• Ihlala isikhathi eside kune-ENIG ngenxa yokungabi nangqimba ye-nickel ngaphansi

OSP / Entek

I-OSP (i-Organic Solderability Preservative) noma i-anti-tarnish igcina ingaphezulu lethusi ekufakweni kwe-oxidation ngokusebenzisa ungqimba oluvikelayo oluncane kakhulu phezu kwethusi eliveziwe ngokuvamile lisebenzisa inqubo yokuthutha.

Isebenzisa i-organic-based organic compound ehlanganisa ngokukhetha ithusi futhi inikeza ungqimba lwe-organometallic oluvikela ithusi ngaphambi kokuhlanganisa.Futhi iluhlaza ngokwedlulele ngokwezemvelo uma iqhathaniswa nezinye izinto ezijwayelekile ezingenamthofu, ezihlushwa ukuba nobuthi obuthe xaxa noma ukusetshenziswa kwamandla okuphezulu kakhulu.

Izinzuzo:

• I-Flat Surface
• Ayikho i-Pb
• Inqubo elula
• Isebenza kabusha
• Kuqiza kahle

Ububi:

• Ayikho Indlela Yokukala Ubukhulu
• Ayilungele i-PTH (Ifakwe Ngezimbobo)
• Impilo Yeshelufu Elifushane
• Ingabangela Izinkinga ze-ICT
• I-Cu Eveziwe Emhlanganweni Wokugcina
• Ukuphatha Kuyazwela

I-Electroless Nickel Immersion Gold (ENIG)

I-ENIG iwugqinsi lwensimbi oluyizingqimba ezimbili lwe-2-8 μin Au ngaphezu kuka-120-240 μin Ni.I-Nickel iyisithiyo sethusi futhi iyindawo lapho izingxenye ezidayiselwe khona.Igolide livikela i-nickel ngesikhathi sokugcinwa futhi linikeza ukumelana okuphansi kokuxhumana okudingekayo kumadiphozithi egolide amancane.I-ENIG manje sekuyiyona esetshenziswa kakhulu embonini ye-PCB ngenxa yokukhula nokusebenzisa umthetho we-RoHs.

Ibhodi Lesifunda Eliphrintiwe eline-Chem Gold Surface Finish

Izinzuzo:

• I-Flat Surface
• Ayikho i-Pb
• Ilungele i-PTH (Ifakwe Ngezimbobo)
• Ukuphila Kweshelufu ende

Ububi:

• Kuyabiza
• Ayisebenzi kabusha
• I-Black Pad / Black Nickel
• Ukulimala okuvela ku-ET
• Ukulahleka Kwesiginali (RF)
• Inqubo Eyinkimbinkimbi

I-Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)

U-ENEPIG, osanda kufika emhlabeni webhodi lesifunda lokuqedwa, waqala ukufika emakethe ngasekupheleni kweminyaka yama-90s.Lokhu kunamathela kwensimbi enezingqimba ezintathu ze-nickel, i-palladium, negolide kunikeza inketho engafani nezinye: kuyaboleka.I-crack yokuqala ye-ENEPIG endaweni yokwelashwa kwebhodi lesekethe ephrintiwe yagcwala ukukhiqizwa ngenxa yongqimba lwalo olubiza kakhulu lwe-palladium kanye nesidingo esiphansi sokusebenzisa.

Isidingo somugqa wokukhiqiza ohlukile asizange samukele lezi zizathu ezifanayo.Muva nje, i-ENEPIG isibuyile njengamandla okuhlangabezana nokuthembeka, izidingo zokupakisha, kanye namazinga e-RoHS kuyinhlanganisela nalokhu kuqedwa.Ilungele izinhlelo zokusebenza zemvamisa ephezulu lapho isikhala sinqunyelwe.

Uma kuqhathaniswa namanye ama-top four finishes, i-ENIG, i-Lead Free-HASL, isiliva yokucwiliswa kanye ne-OSP, i-ENEPIG idlula zonke ezingeni lokugqwala kwangemva komhlangano.

Izinzuzo:

• Indawo Ephansi Kakhulu
• Akukho Okuqukethwe Okuholayo
• I-Multi-Cycle Assembly
• Amajoyinti amahle we-Solder
• I-wire Bondable
• Azikho Izingozi Zokugqwala
• Izinyanga eziyi-12 noma Impilo Yeshelufu Enkulu
• Ayikho Ingozi ye-Black Pad

Ububi:

• Kusebiza Kakhulu
• Isebenza Kabusha Ngeminye Imikhawulo
• Icubungula Imikhawulo

Igolide - Igolide Eliqinile

I-Hard Electrolytic Gold iqukethe ungqimba lwegolide olubekwe phezu kwejazi elingumgoqo lenikeli.Igolide eliqinile lihlala isikhathi eside ngokwedlulele, futhi livame ukusetshenziswa ezindaweni ezigqoke kakhulu njengeminwe yesixhumi esinqenqemeni namakhiphedi.

Ngokungafani ne-ENIG, ukujiya kwayo kungahluka ngokulawula ubude besikhathi somjikelezo wokucwenga, nakuba amanani aphansi ajwayelekile eminwe eyigolide elingu-30 μin ngaphezu kwe-nickel engu-100 μin Yekilasi 1 kanye ne-Class 2, 50 μin yegolide ngaphezu kwe-100 μin nickel Yekilasi lesi-3.

Igolide eliqinile alivamisile ukusetshenziswa ezindaweni ezithengiswayo, ngenxa yezindleko zalo eziphakeme kanye nokungabi bikho kwe-solderability.Ubukhulu obukhulu i-IPC ecabanga ukuthi bungadayiswa bungu-17.8 μin, ngakho-ke uma lolu hlobo lwegolide kufanele lusetshenziswe ezindaweni ezizodayiswa, ukujiya okunconyiwe okulinganiselwe kufanele kube ngu-5-10 μin.

Izinzuzo:

• Indawo Eqinile, Eqinile
• Ayikho i-Pb
• Ukuphila Kweshelufu ende

Ububi:

• Kubiza Kakhulu
• Ukucutshungulwa Okungeziwe / Kusebenza Kakhulu
• Ukusetshenziswa kwe-Resist / Tape
• Kudingeka Plating / Ibhasi Amabha
• Ukunqunywa kwemingcele
• Ubunzima Ngokunye Ukuqedwa Kwendawo
• I-Etching Undercut ingaholela ekuqhumeni / ekufakeni
• Ayithengiswa Ngaphezulu kuka-17 μin
• I-Finnish Ayifaki Ngokugcwele Izindonga Zokulandelela, Ngaphandle Kwasezindaweni Zeminwe

Ufuna Indawo Ekhethekile Yokuqeda Yebhodi Lakho Lesekethe?