Me ka hoʻomohala wikiwiki ʻana o nā uila uila a me nā modula kamaʻilio mana, ua lilo nā papa kaapuni keleawe ultra-mānoanoa o 12oz a ma luna aʻe i ʻano o nā papa PCB kūikawā me nā manaʻo ākea ākea, kahi i hoʻopiʻi nui ʻia ka nānā a me ka nānā ʻana o nā mea hana;Me ka hoʻohana ākea o nā papa kaapuni paʻi ma ke kahua uila, ke piʻi aʻe a kiʻekiʻe nā koi hana o nā mea hana.ʻAʻole e hāʻawi wale nā ​​papa kaapuni paʻi i nā pili uila pono a me ke kākoʻo mechanical no nā ʻāpana uila, akā hāʻawi ʻia hoʻi me nā hana hou aku, nā papa paʻi keleawe ultra-mānoanoa i hiki ke hoʻohui i nā kumu mana, hāʻawi i ke kūlana kiʻekiʻe a me ka hilinaʻi kiʻekiʻe. nā huahana i hoʻomohala ʻia e ka ʻoihana PCB a loaʻa nā manaʻo ākea.

I kēia manawa, ua holomua nā limahana noiʻi a me ka hoʻomohala ʻana i ka ʻoihana papa kaapuni pai elua aoao me ka mānoanoa keleawe i pau o 10oz ma o ke ʻano papa o ka mānoanoa o ka hoʻoheheʻe keleawe electroplated + kōkua paʻi mask solder lehulehu.Eia naʻe, liʻiliʻi nā hōʻike e pili ana i ka hana ʻana o ke keleawe ultra-mānoanoa nā papa i paʻi ʻia me ka mānoanoa keleawe pau loa o 12oz a ma luna;ʻO kēia ʻatikala ka mea nui i ka noiʻi kūpono o ke kaʻina hana o 12oz ultra-thick copper multilayer paʻi papa.ʻO ka ʻenehana etching hohonu + ka ʻenehana lamination kūkulu ʻia, ʻike pono i ka hana ʻana a me ka hana ʻana o 12oz ultra-thick copper multilayer paʻi ʻia.

Kaʻina hana

2.1 Hoʻopili i ka hoʻolālā

He 4 papa keia, Outer/inner cooper mānoanoa 12 oz, min laula/space 20/20mil, ahu iho e like me lalo:

2.1 Ka nānā 'ana i nā pilikia

❶ ʻenehana etching keleawe mānoanoa (ʻoi loa ka mānoanoa o ka pahu keleawe, paʻakikī ke kālai ʻia): kūʻai i nā mea hao keleawe 12OZ kūikawā, e hoʻohana i ka ʻenehana etching hohonu maikaʻi a me ka maikaʻi ʻole e ʻike i ke kahakaha ʻana o nā kaapuni keleawe mānoanoa.

❷ ʻenehana lamination keleawe mānoanoa: Hoʻohana ʻia ka ʻenehana o ka ʻenekini ʻaoʻao hoʻokahi ʻaoʻao i hoʻopaʻa ʻia i ka hohonu e ka kaomi ʻana a me ka hoʻopiha ʻana i mea e hōʻemi pono ai i ka paʻakikī o ke kaomi ʻana.I ka manawa like, kōkua ia i ke kaomi ʻana i ka silicone pad + epoxy pad e hoʻoponopono i ka pilikia o ka ultra-thick copper laminate Nā pilikia ʻenehana e like me nā kiko keʻokeʻo a me ka lamination.

❸ ʻO ka mana pololei o nā alignments ʻelua o ka papa like o nā laina: ke ana ʻana o ka hoʻonui a me ka ʻoki ʻana ma hope o ka lamination, ka hoʻoponopono ʻana i ka hoʻonui a me ka uku hoʻopaʻa ʻana o ka laina;i ka manawa like, hoʻohana ka laina laina i ka LDI laser direct imaging e hōʻoia i ka pololei overlap o nā kiʻi ʻelua.

❹ ʻenehana wili keleawe mānoanoa: Ma ka hoʻonui ʻana i ka wikiwiki o ka hoʻololi ʻana, ka wikiwiki hānai, ka wikiwiki hoʻi, ke ola drill, etc., e hōʻoia i ka maikaʻi o ka wili ʻana.

2.3 Kaʻina hana (e lawe i ka papa 4-layer i laʻana)

2.4 Kaʻina hana

Ma muli o ka ʻeleʻele keleawe mānoanoa nui, ʻaʻohe 12oz mānoanoa papa keleawe ma ka ʻoihana.Inā mānoanoa ka papa kumu i ka 12oz, paʻakikī loa ka etching kaapuni, a paʻakikī ke hōʻoia i ka maikaʻi etching;i ka manawa like, ua hoʻonui nui ʻia ka paʻakikī o ke kaomi ʻana i ke kaapuni ma hope o ka hoʻoheheʻe ʻana i hoʻokahi manawa., Ke alo nei i kahi bottleneck ʻenehana nui aʻe.

I mea e hoʻoponopono ai i nā pilikia i luna, i kēia hana keleawe ultra-mānoanoa, kūʻai pololei ʻia ka mea kūikawā 12oz copper foil i ka wā o ka hoʻolālā hoʻolālā.Hoʻohana ke kaapuni i kahi ʻenehana etching hohonu i hoʻopaʻa ʻia i kēlā me kēia ʻanuʻu, ʻo ia hoʻi, ua kālai mua ʻia ka pahu keleawe 1/2 mānoanoa ma ka ʻaoʻao hope → kaomi ʻia e hana i kahi papa keleawe mānoanoa → etching ma ke alo e loaʻa ai ka papa o loko. ʻano kaʻapuni.Ma muli o ka ʻanuʻu ʻanuʻu, ua hoʻemi nui ʻia ka paʻakikī o ka etching, a ua emi pū ka paʻakikī o ke kaomi ʻana.

❶ Hoʻolālā faila laina
Hoʻolālā ʻia ʻelua mau faila no kēlā me kēia papa o ke kaapuni.Pono e hoʻohālikelike ʻia ka faila maikaʻi ʻole mua e hōʻoia i ke kūlana like o ke kaapuni i ka wā o ka hoʻomalu ʻana i mua / hoʻohuli i ka etching hohonu, a ʻaʻohe misalignment.

❷ Kāohi hoʻohuli i ke kālai ʻana i nā kiʻi kaapuni

❸ Ka mana pololei o ka alignment kiʻi kaapuni lua
I mea e hōʻoiaʻiʻo ai i ka coincidence o nā laina ʻelua, pono e ana ʻia ka hoʻonui ʻana a me ke kumukūʻai ma hope o ka lamination mua, a pono e hoʻoponopono ʻia ka hoʻonui ʻana o ka laina a me ka uku ʻana;i ka manawa like,

ʻO ka alignment maʻalahi o ka LDI laser imaging e hoʻomaikaʻi maikaʻi i ka pololei alignment.Ma hope o ka optimization, hiki ke hoʻomalu i ka pololei alignment i loko o 25um.

❹ Ka mana maikaʻi o ke keleawe mānoanoa nui
I mea e hoʻomaikaʻi ai i ka maikaʻi etching o ka ultra-thick copper circuit, ʻelua mau ʻano o ka etching alkaline a me ka etching acid i hoʻohana ʻia no ka hoʻohālikelike hoʻohālikelike.Ma hope o ka hōʻoia ʻana, ʻoi aku ka liʻiliʻi o nā burrs a me ka pololei o ka laulā laina kiʻekiʻe, hiki ke hoʻokō i nā koi etching o ke keleawe ultra-mānoanoa.Hōʻike ʻia ka hopena ma ka Papa 1.

Me nā pōmaikaʻi o ka hoʻopaʻa ʻana i ka hohonu hohonu, ʻoiai ua hoʻemi nui ʻia ka paʻakikī o ka lamination, inā hoʻohana ʻia ke ʻano maʻamau no ka lamination, ke kū nei nō ia i nā pilikia he nui, a ua maʻalahi ka hana ʻana i nā pilikia maikaʻi huna e like me ka lamination. nā kiko keʻokeʻo a me ka lamination delamination.No kēia kumu, ma hope o ka ho'āʻo hoʻohālikelike kaʻina hana, hiki i ka hoʻohana ʻana i ke kaomi silicone pad ke hōʻemi i ka laminating keʻokeʻo keʻokeʻo, akā ʻaʻole kūlike ka ʻili o ka papa me ka hoʻohele kumu, e pili ana i ka helehelena a me ka maikaʻi o ke kiʻiʻoniʻoni;inā kōkua pū ʻia ka epoxy pad, ʻoi aku ka maikaʻi o ke kaomi ʻana, hiki ke hoʻokō i nā koi koi o ke keleawe ultra-mānoanoa.

❶ ʻano lamination keleawe mānoanoa loa

❷ ʻO ka maikaʻi laminate keleawe mānoanoa nui

I ka hoʻoholo ʻana mai ke ʻano o nā ʻāpana laminated, ua hoʻopiha piha ʻia ke kaʻapuni, me ka ʻole o nā ʻōhū micro-slit, a ua paʻa loa ka ʻāpana hohonu i loko o ka resin;i ka manawa like, ma muli o ka pilikia o ka etching ʻaoʻao keleawe ultra-mānoanoa, ʻoi aku ka nui o ka laulā laina luna ma mua o ka laulā laina haʻahaʻa loa ma waena Ma kahi o 20um, ua like kēia ʻano me kahi "alapii inverted", e hoʻonui hou i ka ka paa ana o ke kaomi ana, he mea kupanaha.

❷ ʻenehana hana keleawe mānoanoa loa

Ke hoʻohana nei i ka ʻenehana etching hohonu + kaʻina hana lamination i ʻōlelo ʻia ma luna, hiki ke hoʻohui ʻia nā papa e ʻike i ka hana ʻana a me ka hana ʻana o nā papa i paʻi ʻia i nā papa i paʻi ʻia.i ka manawa like, i ka wā i hana ʻia ai ka ʻaoʻao o waho, ʻo ka mānoanoa keleawe ma kahi o approx.6oz, ma ka laulā o ke kaʻina hana solder mask maʻamau, hoʻemi nui i ka paʻakikī o ke kaʻina hana o ka hana solder mask a hoʻopōkole i ka pōʻai o ka hana solder mask.

Nā palena wili keleawe mānoanoa nui

Ma hope o ke kaomi ʻana, ʻo ka mānoanoa o ka pā i hoʻopau ʻia he 3.0mm, a ʻo ka mānoanoa keleawe holoʻokoʻa a hiki i 160um, kahi mea paʻakikī ke wili.I kēia manawa, i mea e hōʻoiaʻiʻo ai i ka maikaʻi o ka wili ʻana, ua hoʻoponopono kūikawā ʻia nā ʻāpana wili i ka ʻāina.Ma hope o ka optimization, ua hōʻike ka ʻāpana ʻāpana ʻaʻohe hemahema o ka wili e like me ke poʻo kui a me nā lua koʻikoʻi, a maikaʻi ka hopena.

Hōʻuluʻulu manaʻo
Ma o ke kaʻina hana noiʻi a me ka hoʻomohala ʻana o ka ultra-thick copper multilayer paʻi ʻia, hoʻohana ʻia ka ʻenehana etching hohonu maikaʻi a maikaʻi ʻole, a hoʻohana ʻia ka silicone pad + epoxy pad e hoʻomaikaʻi i ka maikaʻi o ka lamination i ka wā lamination, kahi e hoʻoponopono pono ai i ka. paʻakikī o ke kālai ʻana i ke kaapuni keleawe mānoanoa ʻO nā pilikia ʻenehana maʻamau i ka ʻoihana, e like me nā kiko keʻokeʻo laminate ultra-mānoanoa a me nā paʻi lehulehu no ka mask solder, ua hoʻokō pono i ka hana ʻana a me ka hana ʻana i nā papa paʻi multilayer ultra-thick copper multilayer;ua hōʻoiaʻiʻo ʻia kāna hana e hilinaʻi, a ua māʻona nā mea kūʻai aku koi kūikawā no kēia manawa.

❶ Kaʻana i kēlā me kēia ʻanuʻu i ka ʻenehana etching hohonu no nā laina maikaʻi a maikaʻi ʻole: hoʻoponopono maikaʻi i ka pilikia o ka laina keleawe mānoanoa nui;
❷ ʻenehana kaohi pololei ʻana i ka laina kūpono a maikaʻi ʻole: hoʻomaikaʻi maikaʻi i ka pololei o ka uhi ʻana o nā kiʻi ʻelua;
❸ ʻenehana lamination hana keleawe mānoanoa nui: ʻike pono i ka hana ʻana a me ka hana ʻana i nā papa paʻi ʻia ʻo ultra-thick copper multilayer.

Ka hopena
Hoʻohana nui ʻia nā papa paʻi keleawe mānoanoa nui i nā modula mana mana nui ma muli o kā lākou hana hoʻokele i kēia manawa.ʻOi aku me ka hoʻomau mau ʻana o nā hana ʻoi aʻe, ua paʻa nā papa i paʻi ʻia ke keleawe ultra-mānoanoa e alo i nā manaʻo mākeke.ʻO kēia ʻatikala no ka ʻike a me ka ʻōlelo no nā hoa.