Ukunemba okuphezulu kwebhodi lesifunda ibhekisela ekusetshenzisweni kobubanzi/isikhala somugqa ocolekile, izimbobo ezincane, ububanzi bendandatho ewumngcingo (noma ukungabi nobubanzi bendandatho), nezimbobo ezigqitshiwe nezingaboniyo ukuze kuzuzwe ukuminyana okuphezulu.Futhi ukunemba okuphezulu kusho ukuthi umphumela "womncane, omncane, omncane, omncane" uzoletha izidingo zokunemba okuphezulu nakanjani, thatha ububanzi bomugqa njengesibonelo: O. 20mm ububanzi bomugqa, ngokwemithethonqubo yokukhiqiza i-O. 16 ~ 0.24mm ifanelekile, iphutha lithi (O.20 ± 0.04) mm;kanye no-O. Ngobubanzi bomugqa obungu-10mm, iphutha lithi (0.10±0.02) mm.Ngokusobala, ukunemba kokugcina kuphindwe kabili, nokunye akunzima ukukuqonda, ngakho-ke izidingo zokunemba okuphezulu ngeke kuxoxwe ngazo ngokwehlukana.Kodwa kuyinkinga evelele kubuchwepheshe bokukhiqiza. 
(1) I-Fine wire technology
Ububanzi/isikhala sentambo ephezulu yesikhathi esizayo izoshintshwa isuke ku-0.20mm-O.I-13mm-0.08mm-0.005mm ingahlangabezana nezidingo ze-SMT kanye nephakheji yama-chip amaningi (Iphakheji ye-Multichip, i-MCP).Ngakho-ke, amasu alandelayo ayadingeka.
①Usebenzisa i-foil yethusi ezacile noma ezacile kakhulu (<18um) i-substrate kanye nobuchwepheshe bokwelapha obuphezulu. ② Ukusetshenziswa kwefilimu eyomile ezacile nenqubo yefilimu emanzi, ifilimu eyomile enekhwalithi encane nenhle inganciphisa ukuhlanekezela kobubanzi bomugqa kanye namaphutha.I-lamination emanzi ingavala izikhala ezincane zomoya, ikhulise ukunamathela kobuso, futhi ithuthukise ubuqotho bezintambo nokunemba. ③ Ukusebenzisa ifilimu ye-photoresist ene-electrodeposited (Electro-deposited Photoresist, ED).Ubukhulu bayo bungalawulwa ebangeni lika-5-30/um, elingakhiqiza izintambo ezinhle kakhulu, ezilungele ububanzi bendandatho encane, abukho ububanzi bendandatho kanye ne-electroplating egcwele ibhodi.Njengamanje, kunemigqa yokukhiqiza ye-ED engaphezu kweshumi emhlabeni. ④Ukusebenzisa ubuchwepheshe bokudalulwa kokukhanya okuhambisanayo.Njengoba ukuchayeka kokukhanya okuhambisanayo kunganqoba ithonya lokuhlukahluka kobubanzi bomugqa okubangelwa ukukhanya okutshekile komthombo wokukhanya "wephuzu", izintambo ezinhle ezinobukhulu obunembile bobubanzi bomugqa nemiphetho ehlanzekile zingatholakala.Kodwa-ke, imishini yokuchayeka ehambisanayo iyabiza, idinga ukutshalwa kwezimali okuphezulu, futhi idinga umsebenzi endaweni ehlanzeke kakhulu. ⑤ Yamukela ubuchwepheshe bokuhlola okuzenzakalelayo (Ukuhlola Okuzenzakalelayo, i-AOI).Lobu buchwepheshe sebuyindlela ebalulekile yokuthola lapho kukhiqizwa izintambo ezinhle, futhi buthuthukiswa ngokushesha, busetshenziswa futhi buthuthukiswe.Isibonelo, i-AT&T Company inama-AoI angu-11, futhi}i-tadco Inkampani inama-AoI angu-21 asetshenziswa ngokukhethekile ukuthola imifanekiso yesendlalelo sangaphakathi. (2) Ubuchwepheshe beMicrovia
Izimbobo ezisebenzayo zamabhodi aphrintiwe asetshenziselwa ukukhwezwa kwendawo ikakhulukazi zidlala indima yokuxhumana kukagesi, okwenza ukusetshenziswa kobuchwepheshe be-microvia kubaluleke kakhulu.Ukusebenzisa i-drill bit materials evamile kanye nemishini yokumba ye-CNC ukukhiqiza izimbobo ezincane kunokwehluleka okuningi kanye nezindleko eziphezulu.Ngakho-ke, ukuminyana kwamabhodi aphrintiwe ikakhulukazi ngenxa yokuminyana kwezintambo namaphedi.Nakuba impumelelo enkulu yenziwe, amandla ayo anomkhawulo.Ukuze uqhubeke uthuthukisa ukuminyana (njengezintambo ezingaphansi kuka-0.08mm), izindleko ziyaphuthuma.amalitha, ngaleyo ndlela aphendukele ekusetshenzisweni kwama-micropores ukuthuthukisa ukuminyana.
Eminyakeni yamuva nje, kuye kwenziwa impumelelo emshinini wokumba we-CNC kanye nobuchwepheshe bokubhoboza okuncane, ngakho-ke ubuchwepheshe be-micro-hole buthuthuke ngokushesha.Lesi isici esiyinhloko esivelele ekukhiqizeni kwamanje kwe-PCB.Ngokuzayo, ubuchwepheshe bokwakha izimbobo ezincane buzothembela kakhulu emishinini yokumba ye-CNC ethuthukisiwe namakhanda amancane amahle kakhulu, kuyilapho izimbobo ezakhiwe ubuchwepheshe be-laser zisangaphansi kwalezo ezakhiwe imishini yokumba ye-CNC ngokombono wezindleko kanye nekhwalithi yembobo. . ① Umshini wokumba we-CNC Njengamanje, ubuchwepheshe bomshini wokumba we-CNC buye benza intuthuko nenqubekela phambili entsha.Futhi kwakha isizukulwane esisha somshini wokumba we-CNC obonakala ngokumba izimbobo ezincane.Ukusebenza kahle kokubhoboza izimbobo ezincane (ngaphansi kuka-0.50mm) ngomshini wokugaya i-micro-hole ephakeme izikhathi ezingu-1 kunomshini wokumba ojwayelekile we-CNC, ngokuhluleka okumbalwa, futhi ijubane lokujikeleza liyi-11-15r / min;ingakwazi ukubhoboza imigodi emincane engu-O. 1 ~ 0.2mm, kusetshenziswa izingcezu ezincane zokubhoboza ezinokuqukethwe okuphezulu kwe-cobalt, futhi amapuleti amathathu (1.6mm/block) angapakishwa ukuze kubhojwe.Lapho i-drill bit iphukile, ingakwazi ukuma ngokuzenzakalelayo futhi ibike indawo, ishintshe ngokuzenzakalelayo i-drill bit bese ihlola ububanzi (iphephabhuku lethuluzi lingakwazi ukuhlalisa amakhulu ezicucu), futhi lingakwazi ukulawula ngokuzenzakalelayo ibanga eliqhubekayo phakathi kwephuzu lokubhoboza kanye nesembozo. ipuleti kanye nokujula kokumba, ukuze kubhojwe izimbobo eziyizimpumputhe., futhi ngeke ilimaze i-countertop.Ithebula lomshini wokumba we-CNC lamukela umcamelo womoya kanye nohlobo oluntantayo lukazibuthe, oluhamba ngokushesha, olulula futhi olunembe kakhudlwana, futhi ngeke luklwebhe itafula.Imishini yokubhoboza enjalo iyashoda njengamanje, njengeMega 4600 yasePrute e-Italy, uchungechunge lwe-ExcelIon 2000 e-United States, kanye nemikhiqizo yesizukulwane esisha evela eSwitzerland naseJalimane. ② Kukhona ngempela izinkinga eziningi ngokumba ngelaser imishini yokumba ye-CNC evamile kanye nokubhoboza izimbobo ezincane.Kuvimbe inqubekelaphambili yobuchwepheshe be-micro hole, ngakho-ke ukufakwa kwe-laser hole kuye kwanakwa, kwenziwa ucwaningo kanye nokusetshenziswa.Kodwa kukhona ubungozi obubulalayo, okungukuthi, ukwakheka kwezimbobo zezimpondo, ezibhebhezelwa ukwanda kokuqina kwamapuleti.Ngaphezu kokungcoliswa kokukhishwa kwezinga lokushisa eliphezulu (ikakhulukazi amabhodi anezingqimba eziningi), ukuphila nokugcinwa komthombo wokukhanya, ukuphindaphinda kwembobo ehlabayo kanye nezindleko, ukukhuthazwa kanye nokusetshenziswa kwezimbobo ezincane ekukhiqizweni kwamabhodi aphrintiwe. kube nomkhawulo.Kodwa-ke, i-laser ablation isasetshenziswa kuma-microplates azacile futhi aphezulu, ikakhulukazi kubuchwepheshe be-high-density interconnect (HDI) be-MCM-L, njenge-M. c.Isetshenziswe ekuxhumekeni kokuminyana okuphezulu okuhlanganisa ukufakwa kwefilimu ye-polyester kuNks kanye ne-metal deposition (isu lokufafaza).Ukungcwatshwa ngendlela yokwakheka emabhodini amaningi axhumeke ku-high-density interlayer angcwatshwe futhi angaboni ngezakhiwo nawo angasetshenziswa.Kodwa-ke, ngenxa yentuthuko kanye nempumelelo yezobuchwepheshe yemishini yokumba ye-CNC kanye nezingcezu ezincane zokubhoboza, zithuthukiswe futhi zasetshenziswa ngokushesha.Ngakho-ke i-laser yabhoboza izimbobo phezulu Izinhlelo zokusebenza ezikumabhodi esekethe afakiwe azikwazi ukwenza ukubusa.Kodwa isenayo indawo emkhakheni othile. ③Ubuchwepheshe bokungcwatshwa, ubumpumputhe kanye nembobo Inhlanganisela yobuchwepheshe obungcwatshwe, obungaboni kanye nembobo nakho kuyindlela ebalulekile yokuthuthukisa ukuminyana okuphezulu kwamasekhethi aphrintiwe.Ngokuvamile, izimbobo ezigqitshiwe nezingaboni ziyizimbobo ezincane.Ngaphezu kokwandisa inani lezintambo ebhodini, i-vias engcwatshwe futhi eyimpumputhe ixhunywe phakathi kwezingqimba zangaphakathi "eziseduze", okunciphisa kakhulu inani lezintambo ezibunjiwe, futhi ukumiswa kwe-disc yokuhlukanisa kuzonciphisa kakhulu inani lezintambo. nge.Kuncishiswe, ngaleyo ndlela kukhuphule inani lezintambo ezisebenzayo kanye nokuxhumanisa kwe-interlayer ebhodini, futhi kuthuthukise ukuminyana okuphezulu kokuxhumanisekayo.Ngakho-ke, ibhodi elinezingqimba eziningi elinenhlanganisela yokungcwatshwa, eyimpumputhe kanye ne- through-hole okungenani izikhathi ezingu-3 ziphakeme kunesakhiwo esivamile sebhodi elingaphansi kobukhulu obufanayo kanye nenani lezingqimba.Ubukhulu bebhodi eliphrintiwe elihlanganiswe nezimbobo lizoncishiswa kakhulu noma inani lezendlalelo lizoncishiswa kakhulu.Ngakho-ke, emabhodini aphrintiwe aphezulu aphezulu, angcwatshwa futhi angaboni ngobuchwepheshe aya ngokuya asetshenziswa, hhayi kuphela kumabhodi aphrintiwe angaphezulu kumakhompiyutha amakhulu, imishini yokuxhumana, njll., kodwa nasezinhlelweni zomphakathi nezimboni.Ibuye isetshenziswe kabanzi emkhakheni we-, ngisho nakwamanye amabhodi amancane, njengamabhodi amancane anezingqimba ezingaphezu kweziyisithupha ze-PCMCIA ehlukahlukene, amakhadi e-Smart, IC, njll. I amabhodi wesifunda aphrintiwe anembobo egqitshiwe futhi eyimpumputhe izakhiwo ngokuvamile ziphothulwa indlela yokukhiqiza "ibhodi elihlukanisiwe", okusho ukuthi ingaqedwa kuphela ngemva kwezikhathi eziningi zokucindezela, ukubhoboza, ukumboza imbobo, njll., ngakho-ke ukubeka okunembayo kubaluleke kakhulu.. 
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