other
Blog

What are the types of copper clad laminates commonly used in car wireless charging PCB factories?

  • 2023-04-20 18:17:46


The main material of car wireless charging PCB is copper clad laminate, and copper clad laminate (copper clad laminate) is composed of substrate, copper foil and adhesive. The substrate is an insulating laminate composed of polymer synthetic resin and reinforcing materials; the surface of the substrate is covered with a layer of pure copper foil with high conductivity and good weldability, and the common thickness is 18μm~35μm~50μm; the copper foil is covered on the substrate The copper clad laminate on one side is called single-sided copper clad laminate, and the copper clad laminate with both sides of the substrate covered with copper foil is called double-sided copper clad laminate. Whether the copper foil can be firmly covered on the substrate is completed by the adhesive. Commonly used copper clad laminates have three thicknesses: 1.0mm, 1.5mm and 2.0mm.



What are the types of copper clad laminates
1. According to the mechanical rigidity of the copper clad laminate, it can be divided into: rigid copper clad laminate (Rigid Copper Clad Laminate) and flexible copper clad laminate (Flexible Copper Clad Laminate).
2. According to different insulating materials and structures, it can be divided into: organic resin CCL, metal-based CCL, and ceramic-based CCL.
3. According to the thickness of the copper clad laminate, it can be divided into: thick plate [thickness range of 0.8~3.2mm (including Cu)], thin plate [thickness range of less than 0.78mm (excluding Cu)].
4. According to the reinforcing material of copper clad laminate, it is divided into: glass cloth base copper clad laminate, paper base copper clad laminate, composite base copper clad laminate (CME-1, CME-2).
5. According to the flame retardant grade, it is divided into: flame retardant board and non-flame retardant board.

6. According to UL standards (UL94, UL746E, etc.), the flame retardant grades of CCL are divided, and rigid CCL can be divided into four different flame retardant grades: UL-94V0, UL-94V1, UL-94V2 Class and UL-94HB class.



Common types and characteristics of copper clad laminates
1. Copper-clad phenolic paper laminate is a laminated product made of insulating impregnated paper (TFz-62) or cotton fiber impregnated paper (1TZ-63) impregnated with phenolic resin and hot-pressed. A single sheet of non-alkali glass impregnated cloth, one side covered with copper foil. Primarily used as circuit boards in radio equipment.
2. Copper-clad phenolic glass cloth laminate is a laminated product made of alkali-free glass cloth impregnated with epoxy phenolic resin and hot-pressed. One or both sides are coated with copper foil, which has light weight, electrical and mechanical properties. Good, easy processing and other advantages. The surface of the board is light yellow. If melamine is used as the curing agent, the surface of the board will be light green with good transparency. It is mainly used as a circuit board in radio equipment with high operating temperature and operating frequency.
3. Copper-clad PTFE laminate is a copper-clad laminate made of PTFE as the substrate, covered with copper foil and hot-pressed. It is mainly used for PCB in high-frequency and ultra-high-frequency lines.
4. Copper-clad epoxy glass cloth laminate is a commonly used material for hole metallized circuit boards.
5. The soft polyester copper-clad film is a strip-shaped material made of polyester film and copper hot-pressed. It is rolled into a spiral shape and placed inside the device during application. In order to strengthen or prevent moisture, it is often poured into a whole with epoxy resin. It is mainly used for flexible circuit boards and printed cables, and can be used as a transition line for connectors.
At present, the copper-clad laminates supplied on the market can be divided into the following categories from the perspective of the base material: paper substrate, glass fiber cloth substrate, synthetic fiber cloth substrate, non-woven fabric substrate, and composite substrate.



Commonly used materials for copper clad laminates
FR-1——phenolic cotton paper, this base material is commonly called bakelite (more economical than FR-2) FR-2——phenolic cotton paper FR-3——cotton paper (Cotton paper), epoxy resin FR- 4——Glass cloth (Woven glass), epoxy resin FR-5——glass cloth, epoxy resin FR-6——frosted glass, polyester G-10——glass cloth, epoxy resin CEM-1— ——tissue paper, epoxy resin (flame retardant) CEM-2——tissue paper, epoxy resin (non-flame retardant) CEM-3——glass cloth, epoxy resin CEM-4——glass cloth, epoxy resin CEM -5——glass cloth, polyester AIN——aluminum hydride SIC——silicon carbide

Copyright © 2024 ABIS CIRCUITS CO., LTD. All Rights Reserved. Power by

IPv6 network supported

top

Leave A Message

Leave A Message

    If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.

  • #
  • #
  • #
  • #
    Refresh the image