Qalabka saldhigga ah ee guddiga wareegga ee warshadda PCB-ga elektiroonigga ah ayaa leh oo keliya labada dhinacba naxaasta, dhexdana waa lakabka dahaadhka, markaa uma baahna inay noqdaan kuwo u dhexeeya labada dhinac ama wareegyada lakabka badan ee looxa wareegga?Sidee baa xadhkaha labada dhinac loogu wada xidhi karaa si ay hadda u socoto si habsami ah? Hoosta, fadlan eeg korantada soo saaraha PCB si loo falanqeeyo habkan sixirka ah adiga - copper sinking (PTH). Copper Immersion waa soo gaabinta koodhka Eletcroless Plating Copper, oo sidoo kale loo yaqaan Plated through Hole, oo loo soo gaabiyo PTH, taas oo ah falcelinta dib-u-celinta autocatalytic.Ka dib marka labada lakab ama boodhka badan ee lakabka ah la qodo, habka PTH ayaa la sameeyaa. Doorka PTH: Dusha derbiga godka aan shaqaynayn ee la qoday, lakabka khafiifka ah ee naxaasta kiimikaad ayaa kiimiko ahaan lagu kaydiyaa si ay ugu adeegto sidii substrate-ka xiga ee korantada naxaasta. Qallafsanaanta habka PTH: hoos u dhigista alkaline → biyo raacida sare ama sare ee ka soo horjeedda
Faahfaahinta habsocodka PTH: 1. Xaalufinta alkaline: ka saar wasakhda saliidda, faraha faraha, oksaydhka, iyo boodhka daloollada;hagaajin darbiga daloolka ka soo dallaca taban ilaa lacag togan, taas oo ku haboon adsorption of kolloidal palladium ee habka xiga;Nadiifinta ka dib marka la nadiifiyo waa in si adag loo raacaa tilmaamaha Ku samee tijaabada tijaabada iftiinka dambe ee naxaasta. 2. Micro-etching: ka saar oksaydhyada dusha sare ee looxa, qallaji dusha sare ee looxa, oo hubi in xoogga isku xidhka wanaagsan ee u dhexeeya lakabka immersion naxaasta ee xiga iyo naxaasta hoose ee substrate-ka;oogada cusub ee naxaasta waxay leedahay firfircooni xoog leh waxayna si fiican u adsorb kartaa colloids palladium; 3. Pre-dip: Inta badan waa in laga ilaaliyo taangiga palladium ka wasakhowga dareeraha taangiga pretreatment iyo sii dheeraato nolosha adeegga taangiga palladium.Qaybaha ugu muhiimsan waxay la mid yihiin kuwa taangiga palladium marka laga reebo palladium chloride, kaas oo si wax ku ool ah u qoysin kara derbiga daloolka oo fududeynaya dhaqdhaqaaqa xiga ee dareeraha.Geli godka wakhtiga si aad ugu filnaato oo waxtar u yeelato; 4. Firfircoonida: Ka dib hagaajinta polarity ee pretreatment degreasing alkaline, darbiyada daloolada si togan loo soo dallaci karaa si wax ku ool ah u nuugi karaan qaybo ku filan kolloidal palladium taban si loo hubiyo in lebbiska, sii wadida iyo is haysta ee roobka naxaasta xiga;Sidaa darteed, hoos u dhigista iyo kicinta ayaa aad muhiim ugu ah tayada dhigaalka naxaasta ee xiga.Qodobbada xakamaynta: wakhti cayiman;ion stannous caadiga ah iyo fiirsashada ion koloride;cuf-jiid gaar ah, aashitada iyo heerkulka ayaa sidoo kale aad muhiim u ah, waana in si adag loo xakameeyaa iyadoo loo eegayo tilmaamaha qalliinka. 5. Degumming: ka saar ions aadka u muuqda ee dahaarka leh ee ku yaal bannaanka qaybaha kolloidal palladium si loo soo bandhigo xudunta palladium ee qaybaha kolloidal si ay si toos ah oo waxtar leh u kiciso falcelinta roobka naxaasta.Waayo-aragnimadu waxay muujinaysaa inay wanaagsan tahay in la isticmaalo fluoroboric acid sida wakiilka deguming.s Doorashada. 6. Roobka Copper: Da'da roobka naxaasta ah ee aan elektarooniga ahayn ee falcelinta autocatalytic waxaa keenay firfircoonida nukleus palladium.Naxaasta kiimikaad ee dhowaan la sameeyay iyo falcelinta hydrogen-ga-soo-saarka ayaa loo isticmaali karaa kicinta falcelinta si ay u kiciso falcelinta, si falcelinta roobka naxaasta uu si joogto ah u socdo.Ka dib markii la farsameeyo tillaabadan, lakabka naxaasta kiimikada ayaa lagu dhejin karaa dusha sare ee looxa ama gidaarka daloolka.Inta lagu jiro hawsha, dareeraha qubayska waa in lagu hayaa kicinta hawada caadiga ah si loogu beddelo naxaas bivalent ah oo badan.
Tayada habka qulqulka naxaasta waxay si toos ah ula xiriirtaa tayada guddiga wareegga wax soo saarka.Waa habka isha ugu muhiimsan ee vias liidata, furan iyo wareegyada gaaban, oo kuma habboona kormeerka aragga.Habka soo socda waxaa lagu baari karaa oo kaliya tijaabooyin wax burburiya.Falanqaynta wax ku oolka ah iyo la socodka a guddi PCB hal , marka marka dhibku dhaco, waa in ay noqotaa dhibaato dufcad ah, xitaa haddii tijaabada la dhammayn kari waayo, badeecada ugu dambeysa waxay keenaysaa khataro weyn oo qarsoon oo tayada ah, waxaana lagu xoqin karaa oo kaliya qaybaha, markaa waa in si adag loo shaqeeyaa si waafaqsan xuduudaha tilmaamaha hawlgalka. 
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