Lub hauv paus khoom ntawm lub rooj tsavxwm Circuit Court ntawm lub Hoobkas electro-acoustic PCB tsuas yog muaj cov ntawv ci tooj liab ntawm ob sab, thiab nruab nrab yog cov txheej txheej insulating, yog li lawv tsis tas yuav tsum muaj kev sib txuas ntawm ob sab lossis multi-layer circuits ntawm Circuit Board?Yuav ua li cas cov kab ntawm ob sab sib txuas ua ke kom cov tam sim no ntws zoo? Hauv qab no, thov saib cov electroacoustic PCB chaw tsim tshuaj paus txhawm rau txheeb xyuas cov txheej txheem khawv koob no rau koj - tooj liab dab dej (PTH). Immersion tooj liab yog cov ntawv luv ntawm Eletcroless Plating Copper, tseem hu ua Plated Through Hole, abbreviated li PTH, uas yog cov tshuaj tiv thaiv autocatalytic redox.Tom qab ob-txheej txheej los yog ntau txheej txheej yog drilled, txheej txheem PTH yog nqa tawm. Lub luag hauj lwm ntawm PTH: Ntawm qhov tsis yog-conductive phab ntsa substrate uas tau drilled, ib txheej nyias ntawm cov tshuaj tooj liab yog chemically deposited los ua lub substrate rau tom ntej tooj liab electroplating. PTH txheej txheem decomposition: alkaline degreasing → Secondary los yog tertiary countercurrent rinsing → coarsening (micro-etching) → Secondary countercurrent rinsing → presoak → activation → Secondary countercurrent rinsing → degumming → Secondary countercurrent rinsing → thib ob theem countercurrent
PTH nthuav dav txheej txheem piav qhia: 1. Alkaline degreasing: tshem tawm cov roj stains, ntiv tes, oxides, thiab plua plav hauv qhov hws;kho cov phab ntsa pore los ntawm qhov tsis zoo rau cov nqi zoo, uas yog yooj yim rau adsorption ntawm colloidal palladium hauv cov txheej txheem tom ntej;kev ntxuav tom qab degreasing yuav tsum nruj me ntsis raws li cov lus qhia Ua kom tiav qhov kev sim nrog rau kev ntsuas tooj liab backlight. 2. Micro-etching: tshem tawm cov oxides ntawm lub board nto, roughen lub board nto, thiab xyuas kom meej lub zog sib raug zoo ntawm cov tom ntej tooj liab immersion txheej thiab hauv qab tooj liab substrate;qhov tshiab tooj liab nto muaj zog ua haujlwm thiab tuaj yeem ua tau zoo adsorb colloids palladium; 3. Pre-dip: Nws yog tsuas yog los tiv thaiv lub palladium tank los ntawm cov pa phem ntawm pretreatment tank kua thiab prolong lub neej kev pab cuam ntawm lub palladium tank.Cov khoom tseem ceeb yog tib yam li cov palladium tank tshwj tsis yog rau palladium chloride, uas tuaj yeem ntub cov phab ntsa ntawm lub qhov thiab pab txhawb kev ua kom cov kua dej tom qab.Nkag mus rau lub qhov hauv lub sijhawm kom txaus thiab ua kom muaj txiaj ntsig zoo; 4. Kev ua kom muaj zog: Tom qab kev hloov pauv polarity ntawm alkaline degreasing pretreatment, cov phab ntsa zoo pore tuaj yeem nqus tau qhov tsis zoo ntawm colloidal palladium particles kom muaj qhov sib xws, txuas ntxiv thiab compactness ntawm cov dej nag tom qab tooj liab;Yog li, degreasing thiab ua kom muaj zog yog qhov tseem ceeb heev rau qhov zoo ntawm cov tooj liab tom ntej.Cov ntsiab lus tswj: lub sijhawm teev;tus qauv stannous ion thiab chloride ion concentration;tshwj xeeb lub ntiajteb txawj nqus, acidity thiab kub kuj tseem ceeb heev, thiab lawv yuav tsum tau nruj me ntsis tswj raws li cov lus qhia ua hauj lwm. 5. Degumming: tshem tawm cov stannous ions coated rau sab nraud ntawm cov colloidal palladium hais kom nthuav tawm palladium core nyob rau hauv cov colloidal hais ncaj qha thiab zoo catalyze cov tshuaj tooj liab nag lossis daus.Kev paub qhia tau hais tias nws yog qhov zoo dua los siv fluoroboric acid ua tus neeg sawv cev degumming.s Xaiv. 6. Copper nag lossis daus: electroless tooj liab nag lossis daus autocatalytic tshwm sim los ntawm kev ua kom lub palladium nucleus.Cov tshuaj tooj liab tsim tshiab thiab cov tshuaj tiv thaiv los ntawm cov khoom siv hydrogen tuaj yeem siv los ua cov tshuaj tiv thaiv catalysts rau catalyze cov tshuaj tiv thaiv, kom cov tshuaj tiv thaiv nag lossis daus ntawm tooj liab txuas ntxiv mus.Tom qab ua tiav cov kauj ruam no, ib txheej ntawm cov tshuaj tooj liab tuaj yeem tso rau ntawm lub rooj tsavxwm saum npoo los yog lub qhov phab ntsa.Thaum lub sij hawm tus txheej txheem, cov dej da dej yuav tsum tau khaws cia nyob rau hauv ib txwm huab cua agitation los hloov ntau soluble bivalent tooj liab.
Qhov zoo ntawm cov txheej txheem tooj liab immersion yog ncaj qha ntsig txog qhov zoo ntawm cov khoom siv hluav taws xob.Nws yog lub hauv paus txheej txheem ntawm cov neeg pluag vias, qhib thiab luv circuits, thiab nws tsis yooj yim rau kev soj ntsuam pom.Cov txheej txheem tom ntej tsuas tuaj yeem soj ntsuam los ntawm kev sim ua kom puas tsuaj.Kev soj ntsuam zoo thiab kev saib xyuas ntawm a ib leeg PCB board , yog li thaum muaj teeb meem tshwm sim, nws yuav tsum yog qhov teeb meem batch, txawm tias qhov kev xeem tsis tuaj yeem ua tiav, cov khoom kawg yuav ua rau muaj kev puas tsuaj loj rau qhov zoo, thiab tsuas yog muab pov tseg rau hauv cov khoom siv, yog li nws yuav tsum tau ua nruj me ntsis raws li cov khoom lag luam. parameter ntawm cov lus qhia ua haujlwm. 
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