
TDR testing is currently mainly used in battery circuit board manufacturers' PCB (printed circuit boards) signal lines and device impedance testing. There are many reasons that affect the accuracy of TDR testing, mainly reflection, calibration, reading selection, etc. Reflection will cause serious deviations in the test value of the shorter PCB signal line, especially when the TIP (probe) is used ...
1,铜箔基材CCL (FPC Copper Clad Laminate) It is composed of three layers of copper foil + glue + substrate. In addition, there are also non-adhesive substrates, that is, a combination of two layers of copper foil + substrate, which is relatively expensive and suitable for For products that require more than 10W times of bending life. 1.1 Copper foil In terms of materials, it is divided into rolled copp...
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