Nekuenderera mberi kwekuvandudzwa kwesainzi yemagetsi uye tekinoroji, tekinoroji yePCB yakachinjawo zvikuru, uye maitiro ekugadzira anodawo kufambira mberi.Panguva imwecheteyo indasitiri imwe neimwe paPCB board process zvinodiwa zvishoma nezvishoma zvakavandudzwa, senge mbozhanhare nemakomputa mubhodhi redunhu, kushandiswa kwegoridhe, asiwo kushandiswa kwemhangura, zvichikonzera zvakanakira uye zvakaipira bhodhi zvishoma nezvishoma. zvive nyore kusiyanisa.

Isu tinokutora iwe kuti unzwisise maitiro epamusoro ePCB board, enzanisa zvakanakira uye zvakaipira zvakasiyana PCB bhodhi pamusoro pekupedzisira uye anoshanda mamiriro.

Zvakachena kubva kunze, chikamu chekunze chebhodhi redunhu chine mavara matatu makuru: goridhe, sirivha, chiedza chitsvuku.Zvinoenderana neiyo mutengo categorization: goridhe ndiyo inodhura zvakanyanya, sirivha ndiyo inotevera, tsvuku tsvuku ndiyo yakachipa, kubva muvara zviri nyore chaizvo kuona kana vagadziri ve Hardware vakacheka makona.Nekudaro, iyo yedunhu bhodhi remukati redunhu rinonyanya kuchena mhangura, kureva kuti, isina mhangura bhodhi.

A, Bare copper board
Zvakanakira: mutengo wakaderera, flat surface, yakanaka solderability (munyaya yekusave oxidized).

Zvakaipa: zviri nyore kukanganiswa neasidhi uye humidity, haigoni kuchengetwa kwenguva yakareba, uye inoda kushandiswa mukati maawa maviri mushure mekusunungura, nokuti mhangura inogadziriswa nyore nyore kana iine mhepo;haigone kushandiswa kune yakapetwa kaviri, nekuti chikamu chechipiri chakave ne oxidized mushure mekutanga kuyerera.Kana paine bvunzo poindi, inofanira kuwedzera yakadhindwa solder paste kudzivirira oxidation, zvikasadaro anozotevera haazokwanisi kubata pamwe probe zvakanaka.

Mhangura yakachena inogona kuve nyore oxidized kana yakafumurwa kumhepo, uye iyo yekunze dhizaini inofanirwa kuve neiyo pamusoro inodzivirira layer.Uye vamwe vanhu vanofunga kuti yero yegoridhe imhangura, iyo haisi iyo pfungwa chaiyo, nekuti ndiyo mhangura iri pamusoro pechidziviriro.Saka inoda kuve nzvimbo yakakura yegoridhe yakanamirwa pabhodhi, ndiko kuti, ndakambokuunzirai kuti munzwisise nzira yegoridhe yekunyura.

B, Ndarama-yakanamirwa bhodhi

Kushandiswa kwegoridhe sechigadziko chekuputira, chimwe ndechekufambisa kuputika, chechipiri ndechekudzivirira kuora.Kunyange pashure pemakore anoverengeka endangariro tsvimbo dzeminwe yendarama, dzichiri kupenya sekare, kana kushandiswa kwokutanga kwemhangura, aruminiyamu, simbi, zvino kwaita ngura kuva murwi wezvimedu.

Goridhe plating layer rinoshandiswa zvakanyanya mune redunhu bhodhi chikamu pads, zvigunwe zvegoridhe, yekubatanidza shrapnel nedzimwe nzvimbo.Kana ukaona kuti redunhu bhodhi chaizvoizvo sirivha, zvinoenda pasina kutaura, kudana mutengi kodzero hotline zvakananga, zvinofanira kuva mugadziri akacheka makona, haana kushandisa zvinhu zvakanaka, kushandisa dzimwe simbi kunyengedza vatengi.Isu tinoshandisa inonyanya kushandiswa mbozhanhare bhodhi redunhu rinonyanya goridhe-yakaputirwa bhodhi, yakanyura goridhe bhodhi, makomputa mamabhodhi, odhiyo uye madiki edhijitari edunhu mabhodhi kazhinji haasi goridhe-yakaputirwa bhodhi.

Zvakanakira uye kuipa kweiyo yakanyura goridhe process haina kunetsa kudhirowa.

Zvakanakira: hazvisi nyore kune oxidation, inogona kuchengetwa kwenguva yakareba, nzvimbo yacho yakati sandara, yakakodzera kukwenenzvera mapini epini uye zvikamu zvine majoini madiki ekutengesa.Inofarirwa mabhodhi ePCB ane makiyi (akadai semabhodhi enharembozha).Inogona kudzokororwa kakawanda pamusoro reflow soldering haigone kuderedza solderability yayo.Inogona kushandiswa se substrate yeCOB (Chip On Board) yekumaka.

Kukanganisa: Kudhura kwakakwirira, simba risina simba rekutengesa, nyore kuva nechinetso cheplate yakasviba nekuda kwekushandiswa kwe electroless nickel process.Iyo nickel layer ichaita oxidize nekufamba kwenguva, uye kuvimbika kwenguva refu idambudziko.

Zvino tava kuziva kuti goridhe igoridhe, sirivha isirivha?Chokwadi kwete, itin.

C, HAL/ HAL LF
Silver-colored board inonzi spray tin board.Kupfapfaidza dhizaini remarata nechekunze kwemitsara yemhangura kunogona kubatsirawo kusona.Asi haigone kupa kwenguva refu yekuonana kuvimbika segoridhe.Kune zvikamu zvakatengeswa hazvina simba, asi kwenguva yakareba kuratidzwa kwemhepo pads, kuvimbika hakuna kukwana, zvakadai semapadhi ekugadzirisa, zvigadziko zvepini, nezvimwewo. Kushandiswa kwenguva refu kunowanzoita oxidation uye ngura, zvichiita kuti kutadza kuonana.Inonyanya kushandiswa sediki dhijitari chigadzirwa redunhu bhodhi, pasina kusarudzika, ndiyo yekupfapfaidza tin board, chikonzero chakachipa.

Zvayakanakira nezvayakaipira zvinopfupikiswa sezvizvi

Advantages: mutengo wakaderera, yakanaka solder kuita.

Zvakaipa: hazvikodzeri soldering yakanaka gap pini uye zvidiki zvakanyanyisa zvikamu, nekuti iyo yepamusoro flatness yespray tin board haina kunaka.MuPCB kugadzirisa kuri nyore kugadzira mabedhi erata (solder bead), iyo yakanaka pitch pitch (fine pitch) zvikamu zviri nyore kukonzera pfupi dunhu.Kana ichishandiswa mumativi maviri-mativi eSMT maitiro, nekuti chikamu chechipiri chave chepamusoro-tembiricha kuyerera, zviri nyore kunyungudutsa tini rekupfapfaidza zvakare uye kugadzira marata emarata kana madonhwe emvura akafanana negiravhiti kuita madonhwe enzvimbo dzakatenderera, zvichikonzera yakawanda isina kuenzana pamusoro uye nekudaro inokanganisa dambudziko rekutengesa.

Ambotaurwa yakachipa chiedza dzvuku redunhu bhodhi, kureva, mugodhi rambi thermoelectric kupatsanura mhangura substrate.

4, OSP process board

Organic flux firimu.Nekuti ndeye organic, kwete simbi, saka inochipa pane yekupfapfaidza tin process.

Zvayakanakira nezvayakaipira ndizvo

Advantages: ine zvese zvakanakira zvebare copper board soldering, mabhodhi akapera basa anogona zvakare kudzokororwa kamwechete kurapwa kwepamusoro.

Zvakaipa: Zviri nyore kukanganiswa neasidhi uye humidity.Kana ichishandiswa mukudzokorora kwechipiri, inoda kuitwa mukati meimwe nguva yenguva, uye kazhinji kudzoka kwechipiri kuchave kusinganyanyi kushanda.Kana nguva yekuchengetedza ichipfuura mwedzi mitatu, inofanira kudzorerwa zvakare.OSP is an insulating layer, saka test point inofanirwa kudhindwa ne solder paste kuti ibvise iyo yepakutanga OSP layer kuitira kuti ibate panopindwa tsono pakuyedza magetsi.

Chinangwa chega cheiyi organic firimu ndechekuona kuti iyo yemukati mendarira foil haina oxidized isati yatengeswa.Kana yapiswa panguva ye soldering, iyi firimu inoputika kure.Solder inobva yakwanisa kutengesa waya yemhangura uye zvikamu pamwe chete.

Asi inopesana nekuora, bhodhi yeOSP, yakazarurirwa kumhepo kwemazuva gumi kana kupfuura, haugoni kutengesa zvikamu.

Makombuta mamabhodhi ane yakawanda OSP maitiro.Nekuti nzvimbo yebhodhi yakakura kwazvo kushandisa goridhe plating.