Me ka hoʻomau mau ʻana o ka ʻepekema uila a me ka ʻenehana, ua hoʻololi nui ʻia ka ʻenehana PCB, a pono e holomua ka hana hana.I ka manawa like i kēlā me kēia ʻoihana ma ka PCB papa kaʻina hana pono i hoʻomaikaʻi maikaʻi ʻia, e like me nā kelepona a me nā kamepiula i ka papa kaapuni, ka hoʻohana ʻana i ke gula, akā no ka hoʻohana ʻana i ke keleawe, ka hopena i nā pono a me nā hemahema o ka papa. e maʻalahi ka ʻike.

Lawe mākou iā ʻoe e hoʻomaopopo i ke kaʻina hana o ka papa PCB, e hoʻohālikelike i nā pono a me nā pōʻino o ka pau ʻana o ka papa PCB ʻokoʻa a me nā hiʻohiʻona pili.

Maʻemaʻe mai waho mai, ʻekolu kala nui o ka papa o waho o ka papa kaapuni: gula, kālā, ʻulaʻula māmā.E like me ke kumu kūʻai categorization: gula ka loa pipiʻi, kala ka mea aʻe, 'ulaʻula māmā ka cheapest, mai ka waihoʻoluʻu maoli maʻalahi loa e hoʻoholo inā ua oki kihi nā mea hana.Eia nō naʻe, ʻo ka papa kaapuni i loko ka nui o ke keleawe maʻemaʻe, ʻo ia hoʻi, ka papa keleawe ʻole.

A, Papa keleawe olohelohe
Pōmaikaʻi: ke kumu kūʻai haʻahaʻa, ka ʻili pālahalaha, ka solderability maikaʻi (i ka hihia o ka oxidized ʻole).

Nā pōʻino: maʻalahi ke hoʻopili ʻia e ka waikawa a me ka haʻahaʻa, ʻaʻole hiki ke mālama ʻia no ka manawa lōʻihi, a pono e hoʻohana ʻia i loko o 2 mau hola ma hope o ka wehe ʻana, no ka mea ua maʻalahi ke keleawe i ka wā e ʻike ai i ka ea;ʻAʻole hiki ke hoʻohana ʻia no ka ʻaoʻao ʻelua, no ka mea, ua hoʻokahe ʻia ka ʻaoʻao ʻelua ma hope o ka reflow mua.Inā loaʻa kahi wahi hoʻāʻo, pono e hoʻohui i ka paʻi solder paʻi i mea e pale ai i ka oxidation, inā ʻaʻole hiki i ka mea ma hope ke hoʻopili maikaʻi me ka probe.

Hiki ke maʻalahi ke keleawe maʻemaʻe inā ʻike ʻia i ka ea, a pono e loaʻa i ka ʻaoʻao o waho ka papa pale ma luna.A manaʻo kekahi poʻe he keleawe ka melemele gula, ʻaʻole ia ka manaʻo kūpono, no ka mea, ʻo ia ke keleawe ma luna o ka papa pale.No laila, pono e lilo i wahi nui o ka uhi gula ma ka papa, ʻo ia hoʻi, ua lawe mua au iā ʻoe e hoʻomaopopo i ke kaʻina hana gula.

B, Papa i uhi ʻia i ke gula

ʻO ka hoʻohana ʻana i ke gula ma ke ʻano he papa plating, ʻo ia ka mea e hoʻomaʻamaʻa i ka welding, ʻo ka lua ka pale ʻana i ka corrosion.ʻOiai ma hope o kekahi mau makahiki o nā lāʻau hoʻomanaʻo o nā manamana gula, e ʻālohilohi mau ana e like me ka wā ma mua, inā ʻo ka hoʻohana mua ʻana o ke keleawe, aluminika, hao, i kēia manawa ua ʻōpala i kahi puʻu ʻōpala.

Hoʻohana nui ʻia ka papa ʻaina gula ma nā papa kaapuni ʻāpana, nā manamana gula, nā shrapnel konohiki a me nā wahi ʻē aʻe.Inā ʻike ʻoe he kālā maoli ka papa kaapuni, hele me ka ʻōlelo ʻole, e kāhea pololei i ka hotline kuleana kūʻai, pono ʻo ka mea hana i ʻoki kihi, ʻaʻole i hoʻohana pono i ka mea, me ka hoʻohana ʻana i nā metala ʻē aʻe e hoʻopunipuni i nā mea kūʻai.Hoʻohana mākou i ka papa kaapuni kelepona paʻa i hoʻohana nui ʻia ʻo ka papa gula-plated ka nui, ka papa gula sunken, computer motherboards, audio and small digital circuit boards are usually not gold-plated board.

ʻO nā pōmaikaʻi a me nā pōʻino o ke kaʻina gula sunken ʻaʻole paʻakikī ke huki.

Pōmaikaʻi: ʻaʻole maʻalahi i ka oxidation, hiki ke mālama ʻia no ka manawa lōʻihi, palahalaha ka ʻili, kūpono no ka hoʻopili ʻana i nā pine a me nā ʻāpana me nā hui solder liʻiliʻi.Makemake ʻia no nā papa PCB me nā kī (e like me nā papa kelepona).Hiki ke hana hou i nā manawa he nui ma luna o ka reflow soldering ʻaʻole paha e hōʻemi i kona solderability.Hiki ke hoʻohana ʻia ma ke ʻano he substrate no ka māka COB (Chip On Board).

Nā hemahema: ʻO ke kumukūʻai kiʻekiʻe, ka ikaika solder maikaʻi ʻole, maʻalahi ka pilikia o ka pā ʻeleʻele ma muli o ka hoʻohana ʻana i ka hana nickel electroless.E oxidize ka papa nickel i ka manawa, a he pilikia ka hilinaʻi lōʻihi.

Ano, ua ike kakou he gula ke gula, he kala ke kala?ʻOiaʻiʻo ʻaʻole, ʻo ka tin.

C, HAL/ HAL LF
Kapa ʻia ka papa kala kala.ʻO ka pīpī ʻana i kahi papa o ka pī ma ka ʻaoʻao o waho o nā laina keleawe hiki ke kōkua pū i ke kūʻai ʻana.Akā ʻaʻole hiki ke hāʻawi i ka hilinaʻi pili lōʻihi e like me ke gula.No nā ʻāpana i kūʻai ʻia he liʻiliʻi ka hopena, akā no ka lōʻihi o ka ʻike ʻana i nā pad ea, ʻaʻole lawa ka hilinaʻi, e like me nā pads grounding, nā kumu pōkā pōkā, a me nā mea ʻē aʻe. hoʻopili maikaʻi ʻole.Hoʻohana maʻamau ma ke ʻano he papa kaapuni huahana kikohoʻe liʻiliʻi, me ka ʻole o ka ʻokoʻa, ʻo ia ka papa pāpaʻi pāpaʻi, ʻoi aku ke kumu.

Ua hōʻuluʻulu ʻia kona mau pono a me nā pōʻino e like me kēia

Pōmaikaʻi: kumu kūʻai haʻahaʻa, hana kūʻai maikaʻi.

Nā pōʻino: ʻaʻole kūpono no ke kūʻai ʻana i nā pine awāwa maikaʻi a me nā ʻāpana liʻiliʻi loa, no ka mea, ʻilihune ka palahalaha o ka papa pila.Ma ka hana PCB he mea ma'alahi ke hana i na pe'a tini (solder bead), i ma'alahi ka ma'alahi o ke kaapuni pokole.Ke hoʻohana ʻia i ke kaʻina hana SMT ʻaoʻao ʻelua, no ka mea ʻo ka ʻaoʻao ʻelua he reflow wela kiʻekiʻe, ua maʻalahi ka hoʻoheheʻe hou ʻana i ka pahu e hoʻoheheʻe hou ʻia a hana i nā pahu pahu a i ʻole nā ​​kulu wai like e ka umekaumaha i loko o nā kulu o nā kiko spherical tin, e hopena i kahi ʻoi aku ka ʻili ʻole a pēlā e hoʻopili ai i ka pilikia kūʻai.

Ma mua i ʻōlelo ʻia i ka papa kaapuni ʻulaʻula māmā loa, ʻo ia hoʻi, ʻo ka mine lamp thermoelectric separation copper substrate.

4, OSP papa hana

ʻO ke kiʻiʻoniʻoni kūlohelohe.No ka mea, ʻaʻole metala, no laila ʻoi aku ka maikaʻi ma mua o ke kaʻina hana pā.

ʻO kāna mau mea maikaʻi a me nā hemahema

Pōmaikaʻi: loaʻa nā pono āpau o ka hoʻoheheʻe ʻana i ka papa keleawe, hiki ke hana hou ʻia nā papa pau i ka wā o ka mālama ʻana.

Nā hemahema: Hoʻopilikia maʻalahi ʻia e ka waikawa a me ka haʻahaʻa.Ke hoʻohana ʻia i ka reflow lua, pono e hana ʻia i loko o kekahi manawa, a ʻoi aku ka maikaʻi o ka reflow lua.Inā ʻoi aku ka lōʻihi o ka mālama ʻana i ʻekolu mahina, pono e hoʻāla hou ʻia.He papa insulating ka OSP, no laila, pono e hoʻopaʻa ʻia ka wahi hoʻāʻo me ka solder paste e wehe i ka papa OSP kumu i mea e hoʻopili ai i ke kiko nila no ka hoʻāʻo uila.

ʻO ke kumu wale nō o kēia kiʻi ʻoniʻoni ʻo ia ka hōʻoia ʻana ʻaʻole i oxidized ka foil keleawe o loko ma mua o ke kūʻai ʻana.Ke hoʻomehana ʻia i ka wā e hoʻoheheʻe ʻia, e mahuka ana kēia kiʻiʻoniʻoni.Hiki iā Solder ke hoʻohui i ke kaula keleawe a me nā ʻāpana.

Akā, ua kūpaʻa loa ia i ka corrosion, kahi papa OSP, i hōʻike ʻia i ka lewa no nā lā he ʻumi a i ʻole, ʻaʻole hiki iā ʻoe ke kūʻai aku i nā ʻāpana.

Nui nā kaʻina OSP i nā motherboards kamepiula.No ka mea, nui loa ka ʻāpana o ka papa no ka hoʻohana ʻana i ka pale gula.