Ngokuthuthuka okuqhubekayo kwesayensi ye-elekthronikhi nobuchwepheshe, ubuchwepheshe be-PCB buye baba nezinguquko ezinkulu, futhi inqubo yokukhiqiza nayo idinga ukuqhubekela phambili.Ngesikhathi esifanayo imboni ngayinye ngezidingo zenqubo yebhodi le-PCB ziye zathuthuka kancane kancane, njengomakhalekhukhwini namakhompyutha ebhodini lesifunda, ukusetshenziswa kwegolide, kodwa futhi nokusetshenziswa kwethusi, okuholela ebuhleni nasebubini bebhodi kancane kancane. kube lula ukuhlukanisa.

Sikuthatha ukuze uqonde inqubo engaphezulu yebhodi le-PCB, qhathanisa izinzuzo nezinkinga zokuqeda okuhlukile kwebhodi le-PCB kanye nezimo ezisebenzayo.

Ngokuhlanzekile ngaphandle, ungqimba lwangaphandle lwebhodi lesifunda lunemibala emithathu eyinhloko: igolide, isiliva, ukukhanya okubomvu.Ngokwezigaba zamanani: igolide libiza kakhulu, isiliva lilandela, obomvu okhanyayo ishibhile, kusukela kumbala empeleni kulula kakhulu ukunquma ukuthi abakhiqizi be-hardware bawacime amakhona.Kodwa-ke, isifunda sangaphakathi sebhodi lesifunda ngokuyinhloko siyithusi elihlanzekile, okungukuthi, ibhodi lethusi elingenalutho.

A, Ibhodi lethusi elingenalutho
Izinzuzo: izindleko eziphansi, indawo eyisicaba, i-solderability enhle (uma ingenayo i-oxidized).

Ukungalungi: kulula ukuthintwa i-asidi nomswakama, ayikwazi ukugcinwa isikhathi eside, futhi idinga ukusetshenziswa kungakapheli amahora angu-2 ngemva kokukhipha, ngoba ithusi likhishwa kalula nge-oxidized lapho livezwa emoyeni;ayikwazi ukusetshenziselwa izinhlangothi ezimbili, ngoba uhlangothi lwesibili lufakwe i-oxidized ngemva kokugeleza kabusha kokuqala.Uma kukhona iphuzu test, kumele wengeze ephrintiwe solder unama ukuvimbela oxidation, kungenjalo okwalandela ngeke bakwazi ukuxhumana probe kahle.

I-copper ehlanzekile ingafakwa i-oxidized kalula uma ivezwe emoyeni, futhi ungqimba lwangaphandle kufanele lube nongqimba olungaphezulu lokuvikela.Futhi abanye abantu bacabanga ukuthi okuphuzi kwegolide kuyithusi, akuwona umqondo olungile lowo, ngoba lokho kuyithusi elingaphezu kongqimba oluyisivikelo.Ngakho-ke idinga indawo enkulu yokucwecwa kwegolide ebhodini, okungukuthi, nginilethe ngaphambili ukuze uqonde inqubo yegolide likasinki.

B, Ibhodi elinegolide

Ukusetshenziswa kwegolide njengesendlalelo se-plating, enye iwukuba lula ukushisela, okwesibili ukuvimbela ukugqwala.Ngisho nangemva kweminyaka eminingana yenkumbulo yezinti zeminwe yegolide, zisakhanya njengakuqala, uma ukusetshenziswa kwasekuqaleni kwethusi, i-aluminium, insimbi, manje sekugqwalile kwaba yinqwaba yezicucu.

Isendlalelo segolide se-plating sisetshenziswa kakhulu kumaphedi engxenye yebhodi lesifunda, iminwe yegolide, i-shrapnel yesixhumi nezinye izindawo.Uma uthola ukuthi ibhodi wesifunda empeleni isiliva, akusho ngaphandle kokusho, shayela i-hotline amalungelo umthengi ngqo, kufanele kube umenzi ukusika amakhona, akazange asebenzise impahla kahle, usebenzisa ezinye izinsimbi ukukhohlisa amakhasimende.Sisebenzisa ibhodi lesekhethi yeselula elisetshenziswa kakhulu ibhodi eligqize ngegolide, ibhodi legolide elishoniwe, amabhodi omama wekhompyutha, amabhodi esekethe alalelwayo namancane edijithali ngokuvamile awawona amabhodi afakwe ngegolide.

Izinzuzo kanye nokubi kwenqubo yegolide eshonile empeleni akunzima ukuyidweba.

Izinzuzo: akulula ukwenza i-oxidation, ingagcinwa isikhathi eside, indawo engaphezulu iphansi, ifanele ukushisela izikhonkwane ze-gap emihle kanye nezingxenye ezinamalunga amancane e-solder.Kuncanyelwa amabhodi e-PCB anokhiye (njengamabhodi omakhalekhukhwini).Ingaphinda izikhathi eziningi phezu kwe-reflow soldering cishe ngeke inciphise ukuthengiselana kwayo.Ingasetshenziswa njenge-substrate yokumaka i-COB (Chip On Board).

Ukungalungi: Izindleko eziphakeme, amandla amancane e-solder, kulula ukuba nenkinga yepuleti elimnyama ngenxa yokusetshenziswa kwenqubo ye-nickel engenawo amandla.Isendlalelo se-nickel sizokhipha i-oxidize ngokuhamba kwesikhathi, futhi ukwethembeka kwesikhathi eside kuyinkinga.

Manje siyazi ukuthi igolide igolide, isiliva isiliva?Akunjalo, ithini.

C, HAL/ HAL LF
Ibhodi elinombala oyisiliva libizwa nge-spray tin board.Ukufafaza ungqimba lukathayela ongqimbeni olungaphandle lwemigqa yethusi nakho kungasiza ekuhlanganiseni.Kodwa ayikwazi ukunikeza ukwethembeka kokuxhumana okuhlala isikhathi eside njengegolide.Ezingxenyeni ezidayisiwe zinomphumela omncane, kodwa ngenxa yokuchayeka isikhathi eside kuma-air pads, ukwethembeka akwanele, njengamaphedi aphansi, amasokhethi ephini lenhlamvu, njll. Ukusetshenziswa isikhathi eside kujwayele ukugqwala nokugqwala ukuxhumana okubi.Ngokuyisisekelo esetshenziswa njengebhodi lesifunda elincane lomkhiqizo wedijithali, ngaphandle kokukhetha, ibhodi le-spray tin, isizathu sishibhile.

Izinzuzo zayo kanye nokubi kufinyezwa kanje

Izinzuzo: intengo ephansi, ukusebenza kahle kwe-soldering.

Ukungalungi: akufanelekile ukuthungatha izikhonkwane ze-gap emihle kanye nezingxenye ezincane kakhulu, ngenxa yokuthi ibhodi le-spray tin liphansi kakhulu.In the PCB processing kulula ukukhiqiza tin ubuhlalu (solder bead), the fine pitch pins (pitch fine) izingxenye lula ukudala isekethe iDemo.Uma isetshenziswa kunqubo ye-SMT enezinhlangothi ezimbili, ngenxa yokuthi uhlangothi lwesibili lube ukugeleza kabusha kwezinga lokushisa eliphezulu, kulula ukuncibilikisa ithani lokufutha futhi futhi kukhiqizwe ubuhlalu obuthayela noma amaconsi amanzi afanayo ngamandla adonsela phansi abe amathonsi amachashazi ayindilinga, okuholela ekubeni indawo engalingani futhi ngaleyo ndlela ithinte inkinga ye-solder.

Okushiwo ngaphambilini ukukhanya eshibhe obomvu wesifunda ibhodi, okungukuthi, isibani semayini thermoelectric ngokuhlukanisa substrate yethusi.

4, ibhodi lenqubo ye-OSP

Ifilimu ye-organic flux.Ngoba i-organic, hhayi insimbi, ngakho-ke ishibhile kunenqubo ye-spray tin.

Izinzuzo kanye nebubi bayo

Izinzuzo: inazo zonke izinzuzo ze-solder board ye-copper engenalutho, amabhodi aphelelwe yisikhathi nawo angenziwa kabusha uma ukwelashwa kwendawo.

Ukungalungi: Ithinteka kalula yi-asidi kanye nomswakama.Uma isetshenziselwa ukugeleza kabusha kwesibili, idinga ukwenziwa phakathi nenkathi ethile yesikhathi, futhi ngokuvamile ukugeleza kabusha kwesibili ngeke kungasebenzi kahle.Uma isikhathi sokugcina sidlula izinyanga ezintathu, kufanele sivuswe kabusha.I-OSP iwungqimba oluvikelayo, ngakho iphoyinti lokuhlola kufanele ligxivizwe ngokunamathisela kwe-solder ukuze kukhishwe ungqimba lwe-OSP lwangempela ukuze kuthinteke indawo yenaliti ukuze kuhlolwe ugesi.

Inhloso kuphela yale filimu ephilayo ukuqinisekisa ukuthi i-foil yethusi yangaphakathi ayifakwa oxidized ngaphambi kwe-soldering.Uma isishisisiwe ngesikhathi sokuhlanganisa, le filimu iyahwamuka.I-Solder iyakwazi ukusoda ucingo lwethusi kanye nezingxenye ndawonye.

Kodwa imelana kakhulu nokugqwala, ibhodi le-OSP, elivezwe emoyeni izinsuku eziyishumi noma ngaphezulu, awukwazi ukuthengisa izingxenye.

Amabhodi omama wekhompyutha anenqubo eminingi ye-OSP.Ngoba indawo yebhodi inkulu kakhulu ukusebenzisa i-golden plating.