In copper cladding, in order to achieve the desired effect of copper cladding, we need to pay attention to those issues:
1. If there are many grounds on the PCB, such as SGND, AGND, GND, etc., according to the different positions of the PCB surface, the most important "ground" is used as the reference to independently cover copper, digital ground and analog ground. There is not much to say about the copper coating separately. At the same time, before the copper coating, the corresponding power supply lines are first thickened: 5.0V, 3.3V, etc. In this way, multiple deformable structures of different shapes are formed.
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2. For single-point connection of different grounds, the method is to connect through 0 ohm resistance or magnetic beads or inductance.
3. Copper cladding near the crystal oscillator. The crystal oscillator in the circuit is a high-frequency emission source. The method is to clad copper around the crystal oscillator, and then ground the shell of the crystal oscillator separately.
4. The island (dead zone) problem, if you think it is too big, then it will not cost much to define a ground via and add it.
5. At the beginning of wiring, the ground wire should be treated equally, and the ground wire should be routed well when routing. You cannot rely on the addition of vias after copper coating to eliminate the ground pin for connection. This effect is very bad.
6. It is best not to have sharp corners on the board (<=180 degrees), because from the electromagnetic point of view, this constitutes a transmitting antenna! It will always have an impact on others, but it is big or small. That's it, I recommend using the edge of the arc.
7. Do not pour copper in the open area of wiring in the middle layer of the multi-layer board. Because it is very difficult for you to make this copper pour "good ground".
8. Metals inside the device, such as metal heat sinks, metal reinforcement bars, etc., must be "well grounded".
9. The heat dissipation metal block of the three-terminal voltage stabilizer must be well grounded. The ground isolation belt near the crystal oscillator must be well grounded. In a word: if the copper cladding on the PCB is dealt with properly, it will definitely be "pros outweigh the cons". It can reduce the return area of the signal line and reduce the electromagnetic interference of the signal to the outside.
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