1，铜箔基材CCL (FPC Copper Clad Laminate)

Hoʻokumu ʻia ia i ʻekolu papa o ke keleawe keleawe + glue + substrate.Eia kekahi, aia kekahi mau substrates non-adhesive, ʻo ia hoʻi, kahi hui o ʻelua mau papa keleawe + substrate, kahi mea kūʻai nui a kūpono no ka
No nā huahana e koi ana ma mua o 10W manawa o ke ola kulou.

1.1 Pepa keleawe
Ma keʻano o nā mea, ua māheleʻia i ke keleawe'ōwili (Rolled Anneal Copper Foil) a me ke keleawe electrolytic (Electrodeposited Copper).
Foil), ma ke ʻano o nā hiʻohiʻona, ʻoi aku ka maikaʻi o nā ʻano mechanical o ke keleawe i ʻōwili ʻia, a ʻo ka hapa nui o ke keleawe i ʻōwili ʻia e hoʻohana ʻia ke koi ʻia ka maʻalahi.mānoanoa
No 1/30Z.1/20Z.10Z.2OZ a me nā ʻano ʻehā ʻē aʻe.

1.2 CCL
Ma keʻano o nā mea waiwai, ua māheleʻia i PI (Polyamide) Film a me PET (Polyester) Film.ʻOi aku ke kumukūʻai o PI, akā ʻo ia
ʻOi aku ka maikaʻi o ka pale ʻana i ka lapalapa ahi, a haʻahaʻa ke kumukūʻai o PET, akā ʻaʻole ia he wela.No laila, inā he pono no ka welding, hoʻohana ka hapa nui o lākou i ka mea PI.Ma ka mānoanoa
1/2mil, 1mil, 2mil.

1.3 Hoʻopili
ʻElua mau ʻano kelu: Acrylic (acrylic glue) a me Epoxy (epoxy glue).ʻO ka mea hoʻohana maʻamau ʻo Epoxy glue.mānoanoa
Loaʻa ka 0.4 ~ 2mil, maʻamau e hoʻohana i ka 18um mānoanoa glue.

2, Uhi kiʻiʻoniʻoni
Hoʻokumu ʻia ka kiʻiʻoniʻoni i ka waihona kumu + glue, a ua māhele ʻia kāna mea kumu i PI a me PET.ʻO ka mānoanoa mai 0.5 a 1.4mi.

3, ʻoʻoleʻa ( Mea hoʻoikaika kino )
3.1 Hana: I mea e wili ai i nā ʻāpana ma kahi o ka papa palupalu, e hoʻohui i ka hoʻoikaika no ka hoʻokomo ʻana a hoʻopaʻi i ka mānoanoa o ka papa palupalu.
3.2 Mea Hana: PI/PET/FR4/SUS
3.3 ʻAno hui:
PSA (Pressure Sensitive Adhesive): ʻano koʻikoʻi koʻikoʻi (e like me 3M series)
Thermal Set: Thermosetting (ikaika hoʻopaʻa ʻana, pale ʻana i ka solvent, kūpaʻa wela, kūpaʻa kolo)

4, Hoʻokahi Flex PCB, ʻAlua Flex PCB, Multi Flex PCB

4.1 ʻaoʻao hoʻokahi

4.2 ʻaoʻao pālua

4.3 Papa hui

4.4 Kiʻi kiʻi

4.5 ʻO nā ʻāpana he nui

4.6 ʻO Flex Rigid PCB

Inā he nīnau, e ʻoluʻolu RFQ .