1，铜箔基材CCL (FPC Copper Clad Laminate)

E entsoe ka likarolo tse tharo tsa foil ea koporo + glue + substrate.Ho phaella moo, ho boetse ho na le li-substrate tse sa khomarelang, ke hore, motsoako oa likarolo tse peli tsa foil ea koporo + substrate, e batlang e theko e boima ebile e loketse
Bakeng sa lihlahisoa tse hlokang linako tse fetang 10W tsa bophelo ba ho kobeha.

1.1 Foil ea koporo
Mabapi le lisebelisoa, e arotsoe ka koporo e kolobisitsoeng (Rolled Anneal Copper Foil) le koporo ea electrolytic (Electrodeposited Copper).
Foil), ho ea ka litšoaneleho, thepa ea mochine ea koporo e kolobisitsoeng e molemo, 'me boholo ba koporo e kolobisitsoeng e sebelisoa ha ho hlokahala hore ho be bonolo.botenya
Bakeng sa 1/30Z.1/20Z.10Z.2OZ le mefuta e meng e mene.

1.2 CCL
Mabapi le thepa, e arotsoe ka PI (Polyamide) Film le PET (Polyester) Film.Theko ea PI e phahame, empa eona
E na le khanyetso e ntle ea lelakabe, 'me theko ea PET e tlase, empa ha e sebetsane le mocheso.Ka hona, haeba ho na le tlhokahalo ea ho cheselletsa, boholo ba bona ba sebelisa thepa ea PI.Ka kakaretso ka botenya
1/2mil, 1mil, 2mil.

1.3 Sekhomaretsi
Ka kakaretso ho na le mefuta e 'meli ea sekhomaretsi: Acrylic (acrylic glue) le Epoxy (epoxy glue).E sebelisoang haholo ke sekhomaretsi sa epoxy.botenya
0.4 ~ 2mil lia fumaneha, hangata li sebelisa sekhomaretsi se teteaneng sa 18um.

2, filimi e koahelang
Filimi ea sekoahelo e entsoe ka thepa ea motheo + glue, 'me thepa ea eona ea motheo e arotsoe ka PI le PET.Botenya bo tloha ho 0.5 ho isa ho 1.4mi.

3, Stiffener ( Lintho tse matlafatsang )
3.1 Mosebetsi: E le ho kenya likarolo sebakeng sa sebaka sa boto e bonolo, eketsa matlafatso bakeng sa ho kenya le ho lefella botenya ba boto e bonolo.
3.2 Boitsebiso: PI/PET/FR4/SUS
3.3 Mokhoa oa ho kopanya:
PSA (Adhesive Sensitive Sensitive Adhesive): mofuta oa khatello ea maikutlo (joalo ka letoto la 3M)
Thermal Set: Thermosetting (matla a tlamahano, ho hanyetsa solvent, ho hanyetsa mocheso, khanyetso ea creep)

4, Single Flex PCB, Double Flex PCB, Multi Flex PCB

4.1 Lehlakore le le leng

4.2 Lehlakore le habeli

4.3 Boto e kopaneng

4.4 Ea litšoantšo

4.5 Multilayer

4.6 Flex Rigid PCB

Haeba ho na le potso ka kopo RFQ .