Indlela yokugwema ibhodi lesifunda eliphrintiwe ukulwa

1. Yehlisa umphumela wokushisa ekucindezelekeni kwebhodi
Njengoba [izinga lokushisa] liwumthombo oyinhloko wokucindezeleka kwebhodi, inqobo nje uma izinga lokushisa lehhavini eligeleza kabusha lehliswa noma ijubane lokushisa kwebhodi nokupholisa kuhhavini lokugeleza liyancipha, i-warpage ye-PCB ingancishiswa kakhulu.Kodwa-ke, eminye imiphumela emibi ingase yenzeke, njengezikhindi ze-solder.

2. Sebenzisa ishidi le-Tg eliphezulu
I-Tg izinga lokushisa lokushintsha kwengilazi, okungukuthi, izinga lokushisa lapho impahla ishintsha isuka esimweni sengilazi iye esimweni senjoloba.Uma liphansi inani le-Tg lezinto ezibonakalayo, ibhodi liqala ukuthamba ngokushesha ngemva kokungena kuhhavini eligeleza kabusha, kanye nesikhathi esisithathayo ukuze sibe isimo senjoloba ethambile.Kuzophinde kube yinde, futhi ukuguqulwa kwebhodi kuzoba kubi kakhulu.Ukusetshenziswa kweshidi le-Tg eliphakeme kungakhuphula ikhono lalo lokumelana nokucindezeleka nokuguqulwa, kodwa intengo yezinto ezihambisanayo nayo iphakeme kakhulu.

3. Khulisa ubukhulu bebhodi lesifunda
Ukuze kuzuzwe ukujiya okulula nokuzacile kwemikhiqizo eminingi ye-elekthronikhi, ukujiya kwebhodi kushiywe ku-1.0mm, 0.8mm, ngisho no-0.6mm.Ugqinsi olunjalo kufanele lugcine ibhodi lingakhubazeki ngemva kokudlula esithandweni sokugeleza kabusha, okuyinto enzima ngempela.Ifekthri ye-PCB incoma ukuthi uma kungekho mfuneko yokukhanya nokuba mncane, ibhodi lingasebenzisa ukujiya okungu-1.6mm, okunganciphisa kakhulu ingozi ye-warpage kanye nokuguqulwa kwebhodi le-PCB.

4. Yehlisa ubukhulu bebhodi lesifunda futhi unciphise inani lamaphaneli
Njengoba ama-ovens amaningi agelezayo asebenzisa amaketanga ukushayela ibhodi lesifunda phambili, ibhodi lesifunda elikhudlwana lizobe liboshiwe futhi likhubazekile kuhhavini lokugeleza kabusha ngenxa yesisindo salo, ngakho-ke zama ukubeka uhlangothi olude lwebhodi lesifunda njengonqenqema lwebhodi.Ochungechungeni lwesithando somlilo sokugeleza kabusha, ukuguqulwa kwe-concave okubangelwa isisindo sebhodi lesifunda ngokwalo kungancishiswa.Lesi futhi isizathu sokunciphisa inani lamaphaneli.Okusho ukuthi, lapho udlula isithando somlilo, zama ukusebenzisa uhlangothi oluncane ukuze lube yi-perpendicular isiqondiso sesithando somlilo, esingafinyelela okuphansi kakhulu Inani le-concave deformation.

5. Sebenzisa ithreyi likahhavini
Uma izindlela ezingenhla zinzima ukufeza, into yokugcina ukusebenzisa ithreyi ye-ovini (i-reflow soldering carrier / isifanekiso) ukunciphisa ukuguqulwa kwebhodi lesifunda.Isimiso sokuthi i-tray ye-oven fixture inganciphisa i-warpage yebhodi le-PCB yingoba impahla ye-fixture ijwayelekile.I-aluminium alloy noma itshe lokwenziwa lizosetshenziselwa ukumelana nokushisa okuphezulu, ngakho-ke ifektri ye-PCB izovumela ibhodi lesifunda lidlule ekukhulisweni okushisayo okushisayo kwe-ovini yokugeleza kabusha kanye nokuncipha okubandayo ngemva kokupholisa phansi.Ithreyi ingadlala umsebenzi wokuzinzisa ibhodi lesifunda.Ngemuva kokuthi izinga lokushisa lepuleti liphansi kunevelu ye-Tg futhi liqala ukululama futhi libe lukhuni, usayizi wangempela ungagcinwa.

Uma i-tray-layer fixture ingakwazi ukunciphisa ukuwohloka kwe- ibhodi lesifunda , kufanele wengeze ungqimba lwekhava ukuze ubambe ibhodi lesifunda ngamathreyi aphezulu naphansi, anganciphisa kakhulu ukuguqulwa kwebhodi lesifunda ngokusebenzisa i-oven reflow..Kodwa-ke, leli threyi likahhavini libiza kakhulu, futhi kufanele wengeze umsebenzi ukuze ubeke futhi ugaye kabusha ithreyi.

6. Sebenzisa Irutha esikhundleni sebhodi elingaphansi le-V-Cut
Njengoba i-V-Cut izobhubhisa amandla esakhiwo sephaneli phakathi kwamabhodi, zama ukungasebenzisi i-V-Cut sub-board, noma ukunciphisa ukujula kwe-V-Cut.

Ngicela, noma yimuphi omunye umbuzo I-RFQ .