Ixabiso lemveliso yeshishini lehlabathi le-PCB lokufakwa kwe-electroplating likhule ngokukhawuleza kwixabiso lilonke lemveliso yoshishino lwecandelo lombane.Lishishini elinelona candelo likhulu kushishino lolwahlulo lwecandelo lombane kwaye likwisikhundla esisodwa.Ixabiso lemveliso yonyaka ye-electroplating PCB yi-60 yeebhiliyoni zeedola zaseMelika.Umthamo weemveliso ze-elektroniki uya usiba ngakumbi kwaye ubhityile kwaye umfutshane, kwaye ukupakishwa okuthe ngqo kwe-vias kwi-vias ngokungaboniyo yindlela yoyilo lokufumana uqhagamshelwano oluphezulu.Ukwenza umngxuma wokupakisha kakuhle, okokuqala, ukunyanzeliswa komngxuma ongezantsi kufuneka kwenziwe kakuhle.Kukho iindlela ezininzi zokwenza umngxuma oqhelekileyo we-flat flat, kwaye inkqubo yokuzalisa umngxuma we-electroplating ngummeli omnye. Ukongeza ekunciphiseni imfuno yophuhliso lwenkqubo eyongezelelweyo, inkqubo yokuzalisa i-electroplating kunye nokuzaliswa komngxuma iphinda ihambelane nezixhobo zenkqubo zangoku, ezilungele ukufumana ukuthembeka okulungileyo. Ukuzaliswa komngxuma we-Electroplating kunezi nzuzo zilandelayo: (1) Kuyinzuzo ukuyila iStacked kunye neVia.on.Pad ( Ibhodi yeSekethe yeHDI ); (2) Ukuphucula ukusebenza kombane kunye noncedo uyilo olukwi-frequency ephezulu ; (3) Inceda ukuphelisa ubushushu; (4) Umngxuma weplagi kunye noqhagamshelo lombane lugqityiwe kwinyathelo elinye; (5) Izimbobo ezingaboniyo zizaliswe ngobhedu lwe-electroplated, olunokuthembeka okuphezulu kunye ne-conductivity engcono kune-glue conductive.
IiParameters zempembelelo yoMzimba Iiparamitha ezibonakalayo eziza kufundwa zezi: uhlobo lwe-anode, isithuba se-cathode-anode, ukuxinana kwangoku, ukuphazamiseka, ubushushu, isilungisi kunye ne-waveform, njl. (1) Uhlobo lwe-Anode.Xa kuziwa kwiintlobo ze-anode, ayisiyonto ingaphezulu kwe-anode enyibilikayo kunye ne-anode enganyibilikiyo.I-anodes e-Soluble idla ngokuba neebhola zobhedu ezine-phosphorus, ezilula ukuvelisa i-anode slime, zingcolise isisombululo se-plating, kwaye zichaphazela ukusebenza kwesisombululo se-plating.I-anode enganyibilikiyo, ekwabizwa ngokuba yi-inert anodes, ngokubanzi ine-titanium mesh eqatywe ngee-oxides ezixubeneyo ze-tantalum kunye ne-zirconium.I-anode engaxutywanga, ukuzinza okulungileyo, ukugcinwa kwe-anode, akukho sludge ye-anode, ilungele i-pulse okanye i-DC electroplating;nangona kunjalo, ukusetyenziswa kwezongezo kukhulu. (2) Umgama phakathi kwe-cathode kunye ne-anode.Uyilo lwesithuba phakathi kwe-cathode kunye ne-anode kwi-electroplating ngokusebenzisa inkqubo yokuzalisa kubaluleke kakhulu, kwaye ukuyila kweentlobo ezahlukeneyo zezixhobo zikwahluke.Noko ke, kufanele kuphawulwe ukuba kungakhathaliseki ukuba yenziwe njani na, ayifanele iphule umthetho wokuqala kaFara. (3) Ukushukumisa.Kukho iintlobo ezininzi zokuvuselela, ezifana nokungcangcazela koomatshini, ukungcangcazela kombane, ukungcangcazela kwegesi, ukushukuma komoya, u-Eductor njalo njalo. Ukuzaliswa kwe-electroplating kunye nokuzaliswa, ngokuqhelekileyo kukhethwa ukwandisa i-jet design esekelwe kuqwalaselo lwe-cylinder yethusi yendabuko.Nangona kunjalo, ingaba i-jet ephantsi okanye i-jet yecala, indlela yokulungisa ityhubhu ye-jet kunye ityhubhu evuselela umoya kwi-cylinder;yintoni ukuhamba kwejethi ngeyure;yintoni umgama phakathi kwe-jet tube kunye ne-cathode;ukuba ijethi yecala isetyenzisiwe, ijethi ikwi-anode Front okanye ngasemva;ukuba i-jet ephantsi isetyenzisiwe, ingaba iya kubangela ukungalingani, kwaye isisombululo se-plating siya kuba buthathaka kwaye sihla;Ukwenza uvavanyo oluninzi. Ukongezelela, eyona ndlela ifanelekileyo kukudibanisa ityhubhu yejethi nganye kwimitha yokuhamba, ukuze kufezekiswe injongo yokubeka iliso ukuhamba.Ngenxa yokuhamba kwejethi enkulu, isisombululo sixhomekeke kubushushu, ngoko ke ukulawula ukushisa kubalulekile. (4) Ubuninzi bangoku kunye nobushushu.Uxinzelelo lwangoku oluphantsi kunye nobushushu obuphantsi bunokunciphisa izinga lokubekwa kobhedu olungaphezulu, ngelixa libonelela nge-Cu2 eyaneleyo kunye ne-brightener emngxunyeni.Ngaphantsi kwezi meko, ukukwazi ukuzaliswa komngxuma kuphuculwe, kodwa ukusebenza kakuhle kwe-plating kuyancipha. (5) Umlungisi.I-rectifier iyikhonkco ebalulekileyo kwinkqubo ye-electroplating.Okwangoku, uphando malunga ne-electroplating kunye nokuzaliswa kunqunyelwe kwi-electroplating epheleleyo.Ukuba umzekelo we-electroplating kunye nokuzaliswa kuqwalaselwa, indawo ye-cathode iya kuba yincinci kakhulu.Ngeli xesha, iimfuno eziphezulu zibekwe phambili ukwenzela ukuchaneka kwemveliso yomlungisi. Ukukhethwa kokuchaneka kwesiphumo somlungisi kufuneka kumiselwe ngokomgca wemveliso kunye nobukhulu bomngxuma odlulayo.Imigca emincinci kwaye imingxuma emincinci, iphezulu iimfuno zokuchaneka komlungisi kufuneka zibe.Ngokuqhelekileyo, kuyacetyiswa ukuba ukhethe umlungisi ngokuchaneka kwemveliso ngaphakathi kwe-5%.Ukukhetha isilungisi esichaneke kakhulu kuya kwandisa utyalo-mali kwisixhobo.Xa udibanisa intambo yokukhupha i-rectifier, okokuqala beka i-rectifier kwi-edge ye-plating tank kangangoko kunokwenzeka, enokunciphisa ubude bekhebula lokuphuma kunye nokunciphisa ixesha lokunyuka kwe-pulse current.Ukukhethwa kwenkcazo yentambo yokukhupha i-rectifier kufuneka ihlangabezane nokuhla kwamandla ombane wentambo ye-output cable ngaphakathi kwe-0.6V kwi-80% yowona mkhulu wemveliso yangoku.Ngokuqhelekileyo, indawo efunekayo ye-cable cross-sectional ibalwa ngokuhambelana nomthamo wangoku wokuthwala we-2.5A / mm:.Ukuba ummandla we-cross-sectional we-cable uncinci kakhulu, ubude bentambo bude kakhulu, okanye ukuhla kwamandla ombane kukhulu kakhulu, i-transmission current ayiyi kufikelela kwixabiso langoku elifunekayo kwimveliso. Kwitanki yokucoca kunye nobubanzi betanki ngaphezu kwe-1.6m, indlela yokutya kwamandla amabini kufuneka ithathelwe ingqalelo, kwaye ubude beentambo ezimbini kufuneka zilingane.Ngale ndlela, impazamo yangoku yamazwe amabini inokuqinisekiswa ukuba ilawulwe kuluhlu oluthile.I-rectifier kufuneka idibaniswe kumacala omabini e-flybar nganye yetanki yokucoca, ukwenzela ukuba i-current kumacala amabini esiqhekeza ingalungiswa ngokwahlukileyo. (6) Ukuma kwamaza.Okwangoku, ukusuka kwindawo yokujonga i-waveform, kukho iindidi ezimbini ze-electroplating kunye nokuzaliswa: i-pulse electroplating kunye ne-DC electroplating.Ezi ndlela zimbini ze-electroplating kunye nokuzaliswa komngxuma ziye zafundwa.I-rectifier yendabuko isetyenziselwa i-DC electroplating kunye nokuzaliswa komngxuma, ekulula ukuyisebenzisa, kodwa ukuba ipleyiti inzima, akukho nto inokwenziwa.Isilungisi sePPR sisetyenziselwa ipulse electroplating kunye nokuzaliswa komngxuma, enamanyathelo amaninzi okusebenza, kodwa inamandla okusebenza okusebenza kwiibhodi ezishinyeneyo zenkqubo.
Impembelelo ye-substrate Impembelelo ye-substrate kwi-electroplating kunye nokuzaliswa komngxuma ayikwazi ukuhoywa.Ngokubanzi, kukho izinto ezinje ngezinto zomaleko we-dielectric, imilo yomngxuma, umyinge we-aspect ratio, kunye nokufakwa kweekhemikhali zobhedu. (1) Isixhobo se-Dielectric layer.Izinto eziphathekayo zoluhlu lwe-dielectric zinefuthe ekuzaliseni umngxuma.Iziqinisekiso ezingezizo iiglasi kulula ukuzalisa imingxuma kuneziqinisekiso zefiber zeglasi.Kuyafaneleka ukuba uqaphele ukuba i-glass fiber protrusions emngxunyeni inefuthe elibi kwimichiza yobhedu.Kule meko, ubunzima bokuzaliswa komngxuma we-electroplating kukuphucula ukunamathela kwe-electroless plating seed layer, kunokuba inkqubo yokuzalisa umngxuma ngokwayo. Enyanisweni, i-electroplating kunye nokuzalisa imingxuma kwi-glass fiber reinforced substrates isetyenziswe kwimveliso yangempela. (2) Umlinganiselo wembonakalo.Okwangoku, iteknoloji yokuzalisa umngxuma kwimingxuma yeemilo ezahlukeneyo kunye nobukhulu buxabiswa kakhulu ngabavelisi kunye nabaphuhlisi.Ikhono lokuzalisa umngxuma lichaphazeleka kakhulu ngobunzima bomngxuma ukuya kwi-diameter ratio.Xa sithetha, iinkqubo ze-DC zisetyenziswa kakhulu kurhwebo.Kwimveliso, uluhlu lobungakanani bomngxuma luya kuba luncinci, ngokubanzi ububanzi buyi-80pm ~ 120Bm, ubunzulu bomgodi ngu-40Bm ~ 8OBm, kwaye umlinganiselo we-tight-diameter awudluli i-1: 1. (3) Umaleko wokutyabeka wobhedu ongenambane.Ubukhulu kunye nokufana kwe-electroless copper plating layer kunye nexesha lokuma emva kwe-electroless copper plating yonke ichaphazela ukusebenza kokuzaliswa komngxuma.I-Electroless copper incinci kakhulu okanye inobunzima obungalinganiyo, kwaye isiphumo sayo sokuzalisa umngxuma sibi.Ngokuqhelekileyo, kuyacetyiswa ukuba ugcwalise imingxuma xa ubukhulu bekhemikhali yobhedu bu> 0.3pm.Ukongezelela, i-oxidation yobhedu lweekhemikhali nayo inefuthe elibi kwisiphumo sokuzalisa umngxuma. 
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