Tus nqi tso zis ntawm lub ntiaj teb no electroplating PCB kev lag luam tau loj hlob sai nyob rau hauv tag nrho cov zis tus nqi ntawm cov khoom siv hluav taws xob kev lag luam.Nws yog kev lag luam nrog qhov loj tshaj plaws ntawm cov khoom siv hluav taws xob hauv kev lag luam subdivision thiab occupies ib tug tshwj xeeb txoj hauj lwm.Tus nqi txhua xyoo ntawm electroplating PCB yog 60 billion US dollars.Lub ntim ntawm cov khoom siv hluav taws xob tau dhau los ua ntau dua thiab nyias thiab luv luv, thiab qhov ncaj qha stacking ntawm vias ntawm qhov muag tsis pom vias yog ib txoj hauv kev tsim kom tau txais kev sib txuas ntawm qhov siab.Txhawm rau ua qhov zoo stacking qhov, ua ntej ntawm tag nrho cov, qhov flatness ntawm lub qhov hauv qab yuav tsum ua kom zoo.Muaj ntau ntau txoj hauv kev los ua ib qho chaw tiaj tus, thiab cov txheej txheem electroplating qhov filling yog ib tus neeg sawv cev. Ntxiv nrog rau kev txo cov kev xav tau ntawm kev txhim kho cov txheej txheem ntxiv, cov txheej txheem electroplating thiab lub qhov filling kuj yog sib xws nrog cov txheej txheem cov khoom siv tam sim no, uas yog qhov tsim nyog kom tau txais kev ntseeg tau zoo. Electroplating qhov filling muaj qhov zoo hauv qab no: (1) Nws yog qhov zoo rau tsim Stacked thiab Via.on.Pad ( HDI Circuit Board ); (2) Txhim kho hluav taws xob ua haujlwm thiab pab high-frequency tsim ; (3) Pab kom dissipate cua sov; (4) Lub qhov ntsaws ntsaws thiab hluav taws xob sib txuas tau ua tiav hauv ib kauj ruam; (5) Lub qhov muag tsis pom kev yog ntim nrog electroplated tooj liab, uas muaj kev ntseeg siab dua thiab ua tau zoo dua li cov kua nplaum conductive.
Physical Influence Parameters Cov yam ntxwv ntawm lub cev yuav tsum tau kawm yog: hom anode, cathode-anode spacing, tam sim no ceev, agitation, kub, rectifier thiab waveform, thiab lwm yam. (1) Hom Anode.Thaum nws los txog rau hom anode, nws tsis muaj dab tsi ntau tshaj li soluble anodes thiab insoluble anodes.Soluble anodes feem ntau yog phosphorus-muaj tooj liab pob, uas yog ib qho yooj yim los tsim anode slime, pollute lub plating tov, thiab cuam tshuam rau kev ua tau zoo ntawm cov tshuaj plating.Insoluble anodes, tseem hu ua inert anodes, feem ntau muaj titanium mesh coated nrog tov oxides ntawm tantalum thiab zirconium.Insoluble anode, zoo stability, tsis muaj anode txij nkawm, tsis muaj anode sludge, haum rau mem tes los yog DC electroplating;Txawm li cas los xij, kev noj cov additives yog loj. (2) Qhov kev ncua deb ntawm cathode thiab anode.Qhov sib txawv tsim ntawm cov cathode thiab anode hauv electroplating ntawm cov txheej txheem filling yog qhov tseem ceeb heev, thiab kev tsim cov khoom siv sib txawv kuj txawv.Txawm li cas los xij, nws yuav tsum tau taw qhia tias txawm tias nws tsim los li cas, nws yuav tsum tsis txhob ua txhaum Fara thawj txoj cai. (3) Sib tov.Muaj ntau hom kev nplawm, xws li kev sib tsoo tshuab, hluav taws xob vibration, roj vibration, cua stirring, Eductor thiab lwm yam. Rau electroplating thiab filling, nws yog feem ntau nyiam kom nce lub dav hlau tsim raws li kev teeb tsa ntawm cov tsoos tooj liab lub tog raj kheej.Txawm li cas los xij, txawm tias nws yog lub dav hlau hauv qab lossis sab dav hlau, yuav ua li cas npaj lub dav hlau raj thiab cua tshuab raj hauv lub tog raj kheej;dab tsi yog lub dav hlau ntws ib teev;Dab tsi yog qhov kev ncua deb ntawm lub dav hlau raj thiab lub cathode;Yog hais tias sab dav hlau siv, lub dav hlau nyob ntawm lub anode pem hauv ntej los yog rov qab;Yog tias siv lub dav hlau hauv qab, nws puas yuav ua rau tsis sib xws, thiab cov tshuaj plating yuav tsis muaj zog nplawm nce thiab nqis;Ua ntau qhov kev sim. Tsis tas li ntawd, txoj hauv kev zoo tshaj plaws yog txuas txhua lub dav hlau raj mus rau lub ntsuas dej ntws, thiaj li ua tiav lub hom phiaj ntawm kev saib xyuas qhov ntws.Vim lub dav hlau loj ntws, qhov kev daws teeb meem yog qhov kub thiab txias, yog li kev tswj qhov kub thiab txias kuj tseem ceeb. (4) Tam sim no ceev thiab kub.Tsawg tam sim no ceev thiab kub tsis tshua muaj peev xwm txo qhov deposition tus nqi ntawm nto tooj liab, thaum muab txaus Cu2 thiab brightener rau hauv lub qhov.Nyob rau hauv cov xwm txheej no, lub qhov filling muaj peev xwm txhim kho, tab sis lub plating efficiency kuj txo. (5) Rectifier.Lub rectifier yog qhov txuas tseem ceeb hauv cov txheej txheem electroplating.Tam sim no, kev tshawb fawb ntawm electroplating thiab filling yog feem ntau txwv rau tag nrho-board electroplating.Yog hais tias tus qauv electroplating thiab filling raug txiav txim siab, qhov chaw cathode yuav dhau los ua me me.Lub sijhawm no, cov kev xav tau siab tau muab tso rau pem hauv ntej rau cov zis precision ntawm lub rectifier. Kev xaiv ntawm cov zis precision ntawm lub rectifier yuav tsum tau txiav txim siab raws li txoj kab ntawm cov khoom thiab qhov loj ntawm lub qhov ntawm lub qhov.Qhov thinner cov kab thiab qhov me me ntawm qhov, qhov siab dua qhov yuav tsum tau muaj ntawm lub rectifier yuav tsum yog.Feem ntau, nws raug nquahu kom xaiv lub rectifier nrog cov zis qhov tseeb hauv 5%.Xaiv lub rectifier uas yog qhov tseeb dhau lawm yuav ua rau muaj kev nqis peev hauv cov khoom siv.Thaum xaim cov zis cable ntawm lub rectifier, ua ntej tso lub rectifier rau ntawm ntug ntawm lub plating tank kom ntau li ntau tau, uas yuav txo tau qhov ntev ntawm cov zis cable thiab txo lub sij hawm sawv ntawm cov mem tes tam sim no.Kev xaiv ntawm lub rectifier tso zis cable specification yuav tsum tau raws li cov kab voltage poob ntawm cov zis cable nyob rau hauv 0.6V ntawm 80% ntawm qhov siab tshaj plaws tso zis tam sim no.Feem ntau, qhov xav tau cable hla ntu ntu yog xam raws li tam sim no nqa peev xwm ntawm 2.5A / mm: .Yog hais tias qhov cross-sectional cheeb tsam ntawm cable me me dhau lawm, lub cable ntev ntev dhau lawm, los yog cov kab hluav taws xob poob loj dhau lawm, qhov kev xa tawm tam sim no yuav tsis ncav cuag tus nqi tam sim no rau kev tsim khoom. Rau lub plating tank nrog lub tank dav dua 1.6m, txoj kev ntawm ob sab fais fab noj yuav tsum tau txiav txim siab, thiab qhov ntev ntawm ob sab cables yuav tsum sib npaug.Nyob rau hauv txoj kev no, qhov kev ua yuam kev ob sab tam sim no tuaj yeem lav tau los tswj tau nyob rau hauv qee qhov ntau.Lub rectifier yuav tsum tau txuas mus rau ob sab ntawm txhua lub flybar ntawm lub plating tank, thiaj li hais tias tam sim no ntawm ob sab ntawm daim yuav raug kho nyias. (6) Waveform.Tam sim no, los ntawm lub ntsiab lus ntawm qhov pom, muaj ob hom electroplating thiab filling: mem tes electroplating thiab DC electroplating.Ob txoj kev ntawm electroplating thiab lub qhov filling tau kawm.Cov tsoos rectifier yog siv rau DC electroplating thiab lub qhov filling, uas yog ib qho yooj yim rau kev khiav lag luam, tab sis yog hais tias lub phaj yog thicker, tsis muaj dab tsi yuav ua tau.PPR rectifier yog siv rau pulse electroplating thiab lub qhov filling, uas muaj ntau yam kev khiav hauj lwm cov kauj ruam, tab sis muaj zog ua muaj peev xwm rau thicker nyob rau hauv cov txheej txheem boards.
Kev cuam tshuam ntawm substrate Kev cuam tshuam ntawm substrate ntawm electroplating thiab lub qhov filling tsis tuaj yeem tsis quav ntsej.Feem ntau, muaj ntau yam xws li cov khoom siv dielectric txheej, lub qhov zoo, qhov sib piv, thiab cov tshuaj tooj liab plating. (1) Dielectric txheej khoom.Cov khoom ntawm dielectric txheej muaj qhov cuam tshuam rau lub qhov filling.Cov iav tsis muaj iav yog qhov yooj yim los sau qhov ntau dua li cov iav fiber ntau.Nws yog ib nqi sau cia hais tias cov iav fiber ntau protrusions nyob rau hauv lub qhov muaj ib tug detrimental ntxim rau cov tshuaj tooj liab.Nyob rau hauv cov ntaub ntawv no, qhov nyuaj ntawm electroplating qhov filling yog los txhim kho cov adhesion ntawm electroless plating noob txheej, tsis yog lub qhov filling txheej txheem nws tus kheej. Qhov tseeb, electroplating thiab filling qhov ntawm iav fiber reinforced substrates tau siv rau hauv kev tsim khoom tiag tiag. (2) Aspect ratio.Tam sim no, lub qhov filling tshuab rau qhov sib txawv ntawm cov duab thiab qhov ntau thiab tsawg yog muaj nuj nqis heev los ntawm ob lub tuam txhab thiab cov neeg tsim khoom.Lub qhov filling muaj peev xwm cuam tshuam zoo heev los ntawm lub qhov thickness mus rau txoj kab uas hla piv.Hais txog kev hais lus, DC systems tau siv ntau dua kev lag luam.Hauv kev tsim khoom, qhov loj ntawm lub qhov yuav nqaim, feem ntau txoj kab uas hla yog 80pm ~ 120Bm, qhov tob yog 40Bm ~ 8OBm, thiab thickness-inch ratio tsis tshaj 1: 1. (3) Electroless tooj liab plating txheej.Lub thickness thiab uniformity ntawm electroless tooj liab plating txheej thiab lub sij hawm sawv tom qab electroless tooj liab plating tag nrho cuam tshuam rau lub qhov filling kev ua tau zoo.Electroless tooj liab yog nyias dhau los yog tsis sib xws, thiab nws lub qhov txhaws cov nyhuv tsis zoo.Feem ntau, nws raug pom zoo kom sau qhov thaum lub thickness ntawm cov tshuaj tooj liab yog> 0.3 teev tsaus ntuj.Tsis tas li ntawd, oxidation ntawm cov tshuaj tooj liab kuj muaj kev cuam tshuam tsis zoo rau lub qhov filling nyhuv. 
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